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designed to maximize the performance of extremely high resolution instruments, with precision temperature control, vibration isolation , acoustical absorption, and an electrical system design to virtually eliminate electrical and magnetic field
automatic operation. The wafer probe tool includes coarse and fine stage movement, allowing precise alignment with vibration isolation . Precision Z and theta mechanisms accomodate large pin count probe cards. Load stroke brings wafers out of the
field-tested e-beam immersion column offers high resolution and topographic imaging. The advanced stage and vibration - isolation system claims a three-fold improvement in coordinate accuracy and up to a four-fold increase in defect review