<![CDATA[RSS for Die Attach Film]]> <![CDATA[Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers]]> http://www.electroiq.com/articles/ap/2012/07/henkel-pre-cuts-die-attach-film-for-150mm-200mm-wafers.html <![CDATA[Henkel debuts automotive sensor packaging adhesive]]> http://www.electroiq.com/articles/ap/2011/11/henkel-debuts-automotive-sensor-packaging-adhesive.html <![CDATA[SEMICON West 2011: New product roundup]]> http://www.electroiq.com/articles/sst/2011/july/semicon-west-2011-new-product-roundup.html <![CDATA[Henkel develops die attach film for leadframe packages]]> http://www.electroiq.com/articles/ap/2011/july/henkel-stm-co-develop-die-attach-film-for-leadframe-packages.html <![CDATA[Henkel conductive die attach film for thin die advanced packages]]> http://www.electroiq.com/articles/ap/2011/03/henkel-conductive-die-attach-film-for-thin-die-advanced-packages.html <![CDATA[Hitachi Chemical Henkel die attach film license]]> http://www.electroiq.com/articles/ap/2011/02/hitachi-chemical-henkel-die-attach-film-license.html <![CDATA[WLCSP QFN ELP Semiconductor packaging for consumer applications]]> http://www.electroiq.com/articles/ap/2011/01/wlcsp-qfn-elp-semiconductor-packaging-for-consumer-applications.html <![CDATA[RoHS, device shrinks will continue to drive packaging technology]]> http://www.electroiq.com/articles/ap/2011/01/rohs_-device_shrinks.html <![CDATA[SEMI: Materials bounce back to records, but slowing in 2010]]> http://www.electroiq.com/articles/sst/2010/07/semi_-materials_bounce.html <![CDATA[Recession as the mother of innovation]]> http://www.electroiq.com/articles/sst/print/volume-53/issue-2/columns/industry-forum/recession-as_the_mother.html