<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0">
<channel>
<title><![CDATA[RSS for Vapor Deposition]]></title>
<description><![CDATA[Vapor Deposition news and technical articles from Solid State Technology Magazine. Search Vapor Deposition latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
<atom:link xmlns:atom="http://www.w3.org/2005/Atom" type="application/rss+xml" rel="self" href="http://www.electroiq.com/topics/urss?pageid=488570"/>
<item>
<title><![CDATA[Element Six and Delft University demonstrate milestone in solid-state diamond research]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/element-six-and-delft-university-demonstrate-milestone-in-solid-.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/element-six-and-delft-university-demonstrate-milestone-in-solid-.html</guid>
<pubDate><![CDATA[Mon, 06 May 2013 12:00:00 EDT]]></pubDate>
<description><![CDATA[Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.]]></description>
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<title><![CDATA[Confronting sub-20nm front-end challenges with the “duck and weave”]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/04/confronting-sub-20nm-front-end-challenges-with-the-duck-and-weav.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/04/confronting-sub-20nm-front-end-challenges-with-the-duck-and-weav.html</guid>
<pubDate><![CDATA[Wed, 24 Apr 2013 10:40:00 EDT]]></pubDate>
<description><![CDATA[Just as a boxer avoids a surprise shot to the head or torso by using a “duck and weave” maneuver, so to must front-end technologists confront the challenges associated with extending optical lithography while planning for EUV lithography’s eventual high-productivity solution.]]></description>
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<title><![CDATA[Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/04/veeco-mocvd-chosen-for-cea-leti-and-aledias-new-nano-led-venture.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/04/veeco-mocvd-chosen-for-cea-leti-and-aledias-new-nano-led-venture.html</guid>
<pubDate><![CDATA[Wed, 03 Apr 2013 12:29:00 EDT]]></pubDate>
<description><![CDATA[Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.]]></description>
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<title><![CDATA[SRC, UCLA and ERC utilize atomic layer etch analysis to accelerate development of green chemistries]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/03/src--ucla-and-erc-utilize-atomic-layer-etch-analysis-to-accelera.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/03/src--ucla-and-erc-utilize-atomic-layer-etch-analysis-to-accelera.html</guid>
<pubDate><![CDATA[Thu, 21 Mar 2013 12:04:00 EDT]]></pubDate>
<description><![CDATA[Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used ...]]></description>
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<title><![CDATA[The gleam of well-polished sapphire]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/01/the-gleam-of-well-polished-sapphire.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/01/the-gleam-of-well-polished-sapphire.html</guid>
<pubDate><![CDATA[Tue, 08 Jan 2013 15:06:00 EST]]></pubDate>
<description><![CDATA[Is it time for high-brightness LED manufacturing to get serious about process control?  If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?]]></description>
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<title><![CDATA[2013: Advanced chemistry moves center stage]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/01/2013-advanced-chemistry-moves-center-stage.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/01/2013-advanced-chemistry-moves-center-stage.html</guid>
<pubDate><![CDATA[Fri, 04 Jan 2013 16:03:00 EST]]></pubDate>
<description><![CDATA[We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.]]></description>
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<title><![CDATA[2013: The year of the diamond?]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/01/2012-the-year-of-the-diamond.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/01/2012-the-year-of-the-diamond.html</guid>
<pubDate><![CDATA[Thu, 03 Jan 2013 10:51:00 EST]]></pubDate>
<description><![CDATA[Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.]]></description>
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<title><![CDATA[The gleam of well-polished sapphire]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-1/features/leds/the-gleam-of-well-polished-sapphire.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-1/features/leds/the-gleam-of-well-polished-sapphire.html</guid>
<pubDate><![CDATA[Tue, 01 Jan 2013 01:00:00 EST]]></pubDate>
<description><![CDATA[If an LED manufacturer wants to improve yield or reliability, it's important to know the source of the problem. Rebecca Howland and Tom Pierson, KLA-Tencor, Milpitas, CA.]]></description>
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<title><![CDATA[2013 technology forecast: Unprecedented challenges ahead]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-1/features/technical-forecast/2013-technology-forecast-unprecedented.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-1/features/technical-forecast/2013-technology-forecast-unprecedented.html</guid>
<pubDate><![CDATA[Tue, 01 Jan 2013 01:00:00 EST]]></pubDate>
<description><![CDATA[We asked leading industry experts to give us their perspectives on what we can expect in 2013. The challenges ahead include 450mm, FinFETs and 3D NAND, TSVs and 3D integration, and sensor fusion.]]></description>
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<title><![CDATA[IEDM 2012 slideshow 06]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/12/iedm-2012-slideshow-06.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/12/iedm-2012-slideshow-06.html</guid>
<pubDate><![CDATA[Tue, 04 Dec 2012 12:16:00 EST]]></pubDate>
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</item>
</channel>
</rss>
