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<description><![CDATA[R&D news and technical articles from Solid State Technology Magazine. Search R&D latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
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<title><![CDATA[Printed, flexible and organic electronics sees 15.2% CAGR over the next decade]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/printed--flexible-and-organic-electronics-sees-15-2--cagr-over-t.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/printed--flexible-and-organic-electronics-sees-15-2--cagr-over-t.html</guid>
<pubDate><![CDATA[Fri, 17 May 2013 13:17:00 EDT]]></pubDate>
<description><![CDATA[The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.]]></description>
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<title><![CDATA[Imec and Renesas collaborate on ultra-low power short range radios]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/imec-and-renesas-collaborate-on-ultra-low-power-short-range-radi.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/imec-and-renesas-collaborate-on-ultra-low-power-short-range-radi.html</guid>
<pubDate><![CDATA[Thu, 16 May 2013 11:12:00 EDT]]></pubDate>
<description><![CDATA[Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.]]></description>
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<title><![CDATA[Silicon Valley foundry Noel Technologies adds advanced lithography services]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/silicon-valley-foundry-noel-technologies-adds-advanced-lithograp.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/silicon-valley-foundry-noel-technologies-adds-advanced-lithograp.html</guid>
<pubDate><![CDATA[Thu, 16 May 2013 10:34:00 EDT]]></pubDate>
<description><![CDATA[Foundry hires former ASML’s Keith Best as director of photolithography; tasked with driving roadmap to 0.15 microns]]></description>
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<title><![CDATA[Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/yole-developpement-conducts-2-5d--3dic-and-tsv-interconnect-pate.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/yole-developpement-conducts-2-5d--3dic-and-tsv-interconnect-pate.html</guid>
<pubDate><![CDATA[Wed, 15 May 2013 11:45:00 EDT]]></pubDate>
<description><![CDATA[Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.]]></description>
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<title><![CDATA[NeoPhotonics opens sales and R&D office in Moscow]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/neophotonics-opens-sales-and-r-d-office-in-moscow.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/neophotonics-opens-sales-and-r-d-office-in-moscow.html</guid>
<pubDate><![CDATA[Tue, 14 May 2013 13:34:00 EDT]]></pubDate>
<description><![CDATA[NeoPhotonics Corporation today announced the opening of a sales and R&D office in Moscow and servicing the Russian Federation and the broader eastern European market.]]></description>
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<title><![CDATA[Studying 1/f noise]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/studying-1-f-noise.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/studying-1-f-noise.html</guid>
<pubDate><![CDATA[Mon, 13 May 2013 15:07:00 EDT]]></pubDate>
<description><![CDATA[1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process ...]]></description>
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<title><![CDATA[Despite overall power electronics 2012 downturn, SiC kept on growing]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/despite-overall-power-electronics-2012-downturn--sic-kept-on-gro.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/05/despite-overall-power-electronics-2012-downturn--sic-kept-on-gro.html</guid>
<pubDate><![CDATA[Wed, 08 May 2013 12:11:00 EDT]]></pubDate>
<description><![CDATA[Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.]]></description>
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<title><![CDATA[The UV LED market is booming]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-3/departments/news/the-uv-led-market-is-booming.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-3/departments/news/the-uv-led-market-is-booming.html</guid>
<pubDate><![CDATA[Wed, 01 May 2013 01:00:00 EDT]]></pubDate>
<description><![CDATA[Yole Développement announced its new report "UV LEDs: Technology & Application Trends" which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.]]></description>
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<title><![CDATA[Analysis of TSV proximity effects in planar MOSFETs and FinFETs]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-3/features/packaging/analysis-of-tsv-proximity-effects.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-3/features/packaging/analysis-of-tsv-proximity-effects.html</guid>
<pubDate><![CDATA[Wed, 01 May 2013 01:00:00 EDT]]></pubDate>
<description><![CDATA[The impact of TSV-induced stresses on transistor performance are simulated, and a "keep-out-zone" is identified. Ricardo Borges, Victor Moroz and Xiaopeng Xu, Synopsys, Mountain View, CA.]]></description>
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<title><![CDATA[450mm in 2017: It's coming]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-3/columns/editorial/450mm-in-2017--it-s-coming.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-3/columns/editorial/450mm-in-2017--it-s-coming.html</guid>
<pubDate><![CDATA[Wed, 01 May 2013 01:00:00 EDT]]></pubDate>
<description><![CDATA[The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with ...]]></description>
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