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<title><![CDATA[RSS for Transistor Device]]></title>
<description><![CDATA[Transistor Device news and technical articles from Solid State Technology Magazine. Search Transistor Device latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
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<title><![CDATA[Blog: Dimensional scaling and the SRAM bit-cell]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/03/dimensional-scaling-and-the-sram-bit-cell.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/03/dimensional-scaling-and-the-sram-bit-cell.html</guid>
<pubDate><![CDATA[Thu, 21 Mar 2013 11:07:00 EDT]]></pubDate>
<description><![CDATA[Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.]]></description>
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<title><![CDATA[Xilinx speaker joins 3D packaging webcast roster]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/06/xilinx-speaker-joins-3d-packaging-webcast-roster.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/06/xilinx-speaker-joins-3d-packaging-webcast-roster.html</guid>
<pubDate><![CDATA[Tue, 26 Jun 2012 13:29:00 EDT]]></pubDate>
<description><![CDATA[Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.]]></description>
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<title><![CDATA[Strain characterization: techniques and applications]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-52/issue-2/features/strain-characterization-techniques-and-applications.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-52/issue-2/features/strain-characterization-techniques-and-applications.html</guid>
<pubDate><![CDATA[Sun, 01 Feb 2009 01:02:00 EST]]></pubDate>
<description><![CDATA[The extensive utilization of strain engineering in the semiconductor industry led to the subsequent development and refinement of a variety of analytical techniques that helped to improve manufacturing control of stress level in thin film, as well as to measure strain on individual devices.]]></description>
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<title><![CDATA[Project to develop micro, nano tech for diamond device fabrication concludes with launch]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2008/05/project-to-develop-micro-nano-tech-for-diamond-device-fabrication-concludes-with-launch.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2008/05/project-to-develop-micro-nano-tech-for-diamond-device-fabrication-concludes-with-launch.html</guid>
<pubDate><![CDATA[Tue, 27 May 2008 07:05:00 EDT]]></pubDate>
<description><![CDATA[May 27, 2008 -- The Micromachined Diamond Device Initiative (MIDDI), led by UK researchers at Element Six Ltd in collaboration with the Institute of Photonics at The University of Strathclyde has concluded, and its "successful outcomes have already underpinned the formation of a new subsidiary by ...]]></description>
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<title><![CDATA[EU research group reports working 32nm CMOS SRAM]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2007/07/eu-research-group-reports-working-32nm-cmos-sram.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2007/07/eu-research-group-reports-working-32nm-cmos-sram.html</guid>
<pubDate><![CDATA[Tue, 10 Jul 2007 12:07:00 EDT]]></pubDate>
<description><![CDATA[July 10, 2007 - PULLNANO, a European Commission-sponsored research project, says it has developed a functional demo of a CMOS SRAM built with 32nm design rules.]]></description>
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<title><![CDATA[Manufacturing progress key to flexible electronics’ success]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/print/volume-7/issue-3/technology/innovations/manufacturing-progress-key-to-flexible-electronicsrsquo-success.html]]></link>
<guid>http://www.electroiq.com/articles/stm/print/volume-7/issue-3/technology/innovations/manufacturing-progress-key-to-flexible-electronicsrsquo-success.html</guid>
<pubDate><![CDATA[Tue, 01 May 2007 01:05:00 EDT]]></pubDate>
<description><![CDATA[As the first commercial flexible electronics reach consumers, many significant manufacturing and technological obstacles must be overcome for the market to reach its multi-billion-dollar potential over the next five to ten years.]]></description>
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<title><![CDATA[Volume production necessary for flexible electronics]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2007/02/volume-production-necessary-for-flexible-electronics.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2007/02/volume-production-necessary-for-flexible-electronics.html</guid>
<pubDate><![CDATA[Mon, 26 Feb 2007 10:02:00 EST]]></pubDate>
<description><![CDATA[For the emerging flexible thin-film, organic, and printed electronics markets to flourish, most industry professionals agree that roll-to-roll (R2R) processing must be implemented on the factory floor. But how will manufacturing will be leveraged into successful, scaleable R2R approaches? ...]]></description>
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<title><![CDATA[An analytical look at vertical transistor structures]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-47/issue-8/features/device-engineering/an-analytical-look-at-vertical-transistor-structures.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-47/issue-8/features/device-engineering/an-analytical-look-at-vertical-transistor-structures.html</guid>
<pubDate><![CDATA[Sun, 01 Aug 2004 01:08:00 EDT]]></pubDate>
<description><![CDATA[The combination of device enhancements, such as strained silicon configurations, SOI, and nonplanar transistor device structures, in conjunction with the current state-of-the art global efforts in high- k gate dielectrics, metal gate electrodes and elevated source/drain, offers a plethora of ...]]></description>
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<title><![CDATA[A new class of insulating materials: Emergence of ultralow- k]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-44/issue-9/copper-low-k-dielectrics/low-k-dielectrics/a-new-class-of-insulating-materials-emergence-of-ultralow-ik-i.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-44/issue-9/copper-low-k-dielectrics/low-k-dielectrics/a-new-class-of-insulating-materials-emergence-of-ultralow-ik-i.html</guid>
<pubDate><![CDATA[Sat, 01 Sep 2001 01:09:00 EDT]]></pubDate>
<description><![CDATA[As transistor scaling extends below the 0.18?m technology node, propagation delays associated with interconnects begin to bottleneck the operating speeds of transistors. New interconnect materials are needed to reduce the RC time constant associated with the delays.]]></description>
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<title><![CDATA[New products]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/print/volume-10/issue-2/departments/new-products/new-products.html]]></link>
<guid>http://www.electroiq.com/articles/ap/print/volume-10/issue-2/departments/new-products/new-products.html</guid>
<pubDate><![CDATA[Thu, 01 Feb 2001 01:02:00 EST]]></pubDate>
<description><![CDATA[Benchtop Lead Attach Machine Die-Tech's Model 3005 attaches single in-line placement leadframes to substrates and is an alternative to hand-tooling]]></description>
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