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<title><![CDATA[RSS for Nil]]></title>
<description><![CDATA[Nil news and technical articles from Solid State Technology Magazine. Search Nil latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
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<title><![CDATA[EV Group rolls out EVG120 processing system]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/05/ev-group-rolls-out-evg120-processing-system.html]]></link>
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<pubDate><![CDATA[Tue, 07 May 2013 10:42:00 EDT]]></pubDate>
<description><![CDATA[EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG120 automated resist processing system.]]></description>
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<title><![CDATA[EVG's wafer bonder passes SEMATECH/ISMI 3D integration tool assessment]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/07/evg-wafer-bonder-passes-sematech-ismi-3d-integration-tool-assessment.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/07/evg-wafer-bonder-passes-sematech-ismi-3d-integration-tool-assessment.html</guid>
<pubDate><![CDATA[Wed, 11 Jul 2012 08:11:00 EDT]]></pubDate>
<description><![CDATA[SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.]]></description>
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<title><![CDATA[EVG wins repeat order from wafer-level camera maker]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/03/evg-wins-repeat-order-from-wafer-level-camera-maker.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/03/evg-wins-repeat-order-from-wafer-level-camera-maker.html</guid>
<pubDate><![CDATA[Tue, 27 Mar 2012 14:51:00 EDT]]></pubDate>
<description><![CDATA[Himax Technologies placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.]]></description>
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<title><![CDATA[Shin-Etsu Chemical joins EVG wafer bonding supply chain]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/03/shin-etsu-chemical-joins-evg-wafer-bonding-supply-chain.html]]></link>
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<pubDate><![CDATA[Wed, 14 Mar 2012 10:43:00 EDT]]></pubDate>
<description><![CDATA[EV Group (EVG) welcomed Shin-Etsu Chemical  into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.]]></description>
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<title><![CDATA[EVG wafer clean tool installed at Tokyo Institute of Technology]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/03/evg-wafer-clean-tool-installed-at-tokyo-institute-of-technology.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/03/evg-wafer-clean-tool-installed-at-tokyo-institute-of-technology.html</guid>
<pubDate><![CDATA[Thu, 01 Mar 2012 11:50:00 EST]]></pubDate>
<description><![CDATA[EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.]]></description>
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<title><![CDATA[EVG LED mask aligner offers COO improvement in gen-2]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/02/evg-led-mask-aligner-offers-coo-improvement-in-gen-2.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/02/evg-led-mask-aligner-offers-coo-improvement-in-gen-2.html</guid>
<pubDate><![CDATA[Tue, 07 Feb 2012 11:29:00 EST]]></pubDate>
<description><![CDATA[EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.]]></description>
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<title><![CDATA[MOCVD cools down, LED downstream processing heats up]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/01/mocvd-cools-down-led-downstream-processing-heats-up.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/01/mocvd-cools-down-led-downstream-processing-heats-up.html</guid>
<pubDate><![CDATA[Mon, 30 Jan 2012 14:57:00 EST]]></pubDate>
<description><![CDATA[Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.]]></description>
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<title><![CDATA[EVG integrates UV lithography from Eulitha on mask aligner]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/01/evg-integrates-uv-lithography-from-eulitha-on-mask-aligner.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/01/evg-integrates-uv-lithography-from-eulitha-on-mask-aligner.html</guid>
<pubDate><![CDATA[Tue, 10 Jan 2012 10:22:00 EST]]></pubDate>
<description><![CDATA[EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.]]></description>
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<title><![CDATA[EVG installs UV-lithography system at Asahi Kasei]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2011/12/evg-installs-uv-lithography-system-at-akm-for-lens-materials-work.html]]></link>
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<pubDate><![CDATA[Tue, 06 Dec 2011 10:23:00 EST]]></pubDate>
<description><![CDATA[Asahi Kasei E-Materials Corporation purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group (EVG).]]></description>
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<title><![CDATA[EVG moves Chinese SOI bonder customer to full automation]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2011/11/evg-moves-chinese-soi-bonder-customer-to-full-automation.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2011/11/evg-moves-chinese-soi-bonder-customer-to-full-automation.html</guid>
<pubDate><![CDATA[Thu, 10 Nov 2011 10:37:00 EST]]></pubDate>
<description><![CDATA[Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.]]></description>
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