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<description><![CDATA[Chemical Distribution news and technical articles from Solid State Technology Magazine. Search Chemical Distribution latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
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<title><![CDATA[2013: 450mm is the next big opportunity]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/01/2013-450mm-is-the-next-big-opportunity.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/01/2013-450mm-is-the-next-big-opportunity.html</guid>
<pubDate><![CDATA[Thu, 03 Jan 2013 11:08:00 EST]]></pubDate>
<description><![CDATA[In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.]]></description>
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<title><![CDATA[450mm is the next big opportunity]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-56/issue-1/columns/semiconductors/450mm-is-the-next-big-opportunity.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-56/issue-1/columns/semiconductors/450mm-is-the-next-big-opportunity.html</guid>
<pubDate><![CDATA[Tue, 01 Jan 2013 01:00:00 EST]]></pubDate>
<description><![CDATA[A major challenge facing the industry in the coming year is how to deliver products faster without affecting budgets or compromising safety and quality.]]></description>
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<title><![CDATA[LED PSS etch station speeds throughput with higher temps]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2011/11/led-pss-etch-station-speeds-throughput-with-higher-temps.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2011/11/led-pss-etch-station-speeds-throughput-with-higher-temps.html</guid>
<pubDate><![CDATA[Wed, 30 Nov 2011 11:44:00 EST]]></pubDate>
<description><![CDATA[MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.]]></description>
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<title><![CDATA[CVD replacement coats solar cells with fewer defects, lower cost]]></title>
<link><![CDATA[http://www.electroiq.com/articles/pvw/2011/10/cvd-replacement-coats-solar-cells-with-fewer-defects-lower-cost.html]]></link>
<guid>http://www.electroiq.com/articles/pvw/2011/10/cvd-replacement-coats-solar-cells-with-fewer-defects-lower-cost.html</guid>
<pubDate><![CDATA[Mon, 17 Oct 2011 15:24:00 EDT]]></pubDate>
<description><![CDATA[MicroTech Systems delivered its first intelligent process station for anti-reflective coating (ARC) on solar cells. The liquid phase deposition wet process grows ARC on solar silicon wafers, replacing chemical vapor deposition for the fabrication step.]]></description>
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<title><![CDATA[Suppression of galvanic corrosion in advanced BEOL integration]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-52/issue-9/features/wafer-cleaning/suppression-of-galvanic-corrosion-in-advanced-beol-integration.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-52/issue-9/features/wafer-cleaning/suppression-of-galvanic-corrosion-in-advanced-beol-integration.html</guid>
<pubDate><![CDATA[Tue, 01 Sep 2009 01:09:00 EDT]]></pubDate>
<description><![CDATA[A single-wafer closed chamber system has been developed to control oxygen levels in the processing fluid and chamber atmosphere to eliminate oxygen corrosion reaction. Jeffery M. Lauerhaas, FSI International]]></description>
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<title><![CDATA[Yesterday’s purity isn’t enough]]></title>
<link><![CDATA[http://www.electroiq.com/articles/cr/print/volume-21/issue-12/features/special-report/yesterdayrsquos-purity-isnrsquot-enough.html]]></link>
<guid>http://www.electroiq.com/articles/cr/print/volume-21/issue-12/features/special-report/yesterdayrsquos-purity-isnrsquot-enough.html</guid>
<pubDate><![CDATA[Sat, 01 Dec 2007 01:12:00 EST]]></pubDate>
<description><![CDATA[Continually scaling circuit features have led to tightened process requirements, including the purity levels of gas and liquid chemicals used in semiconductor manufacturing.]]></description>
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<title><![CDATA[M+W Zander receives first photovoltaic contract in Italy]]></title>
<link><![CDATA[http://www.electroiq.com/articles/cr/2007/11/mw-zander-receives-first-photovoltaic-contract-in-italy.html]]></link>
<guid>http://www.electroiq.com/articles/cr/2007/11/mw-zander-receives-first-photovoltaic-contract-in-italy.html</guid>
<pubDate><![CDATA[Sun, 25 Nov 2007 19:11:00 EST]]></pubDate>
<description><![CDATA[November 20, 2007 -- STUTTGART, GERMANY, and RIETI, ITALY -- M+W Zander Italia S.r.I. has received its first contract for a photovoltaic (PV) plant in Italy from its Customer SOLSONICA S.p.A.]]></description>
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<title><![CDATA[Cost, production, and logistics implications of C4NP solder bumping]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/print/volume-50/issue-1/departments/tap/cost-production-and-logistics-implications-of-c4np-solder-bumping.html]]></link>
<guid>http://www.electroiq.com/articles/sst/print/volume-50/issue-1/departments/tap/cost-production-and-logistics-implications-of-c4np-solder-bumping.html</guid>
<pubDate><![CDATA[Mon, 01 Jan 2007 01:01:00 EST]]></pubDate>
<description><![CDATA[The newest generation of bumping technology, called Controlled Collapse Chip Connection: New Process (C4NP), works with lead-free solder alloys.]]></description>
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<title><![CDATA[Diffusion and resolution for chemically amplified resists]]></title>
<link><![CDATA[http://www.electroiq.com/articles/mlw/print/volume-15/issue-3/featured/diffusion-and-resolution-for-chemically-amplified-resists.html]]></link>
<guid>http://www.electroiq.com/articles/mlw/print/volume-15/issue-3/featured/diffusion-and-resolution-for-chemically-amplified-resists.html</guid>
<pubDate><![CDATA[Tue, 01 Aug 2006 01:08:00 EDT]]></pubDate>
<description><![CDATA[As discussed in the last edition of this column (MLW, May 2006), diffusion in conventional (nonchemically amplified) resists has a very predictable (and undesirable) impact on resolution.]]></description>
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<title><![CDATA[Modular metrology, strain engineering, and managing waste]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2006/07/modular-metrology-strain-engineering-and-managing-waste.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2006/07/modular-metrology-strain-engineering-and-managing-waste.html</guid>
<pubDate><![CDATA[Tue, 18 Jul 2006 12:07:00 EDT]]></pubDate>
<description><![CDATA[Spanning the SEMICON West show floor, SST Senior Ed Korczynski reports on equipment providers' merger progress, market strategies, and new and improved technology offerings ranging from metrology to wafer cleaning to liquid waste abatement.]]></description>
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