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<title><![CDATA[RSS for Package Test]]></title>
<description><![CDATA[Package Test news and technical articles from Solid State Technology Magazine. Search Package Test latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
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<title><![CDATA[Dreaming of plug-and-play IP]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/12/dreaming-of-plug-and-play-ip.html]]></link>
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<pubDate><![CDATA[Mon, 17 Dec 2012 16:44:00 EST]]></pubDate>
<description><![CDATA[Stephen Pateras, product marketing director for Mentor Graphics Silicon Test products, blogs about the new IJTAG standard, which enables "plug and play" automation for SoC design.]]></description>
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<title><![CDATA[Multitest test handler adds 2D code reader option for traceability]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/08/multitest-test-handler-adds-2d-code-reader-option-for-traceability.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/08/multitest-test-handler-adds-2d-code-reader-option-for-traceability.html</guid>
<pubDate><![CDATA[Wed, 08 Aug 2012 12:35:00 EDT]]></pubDate>
<description><![CDATA[Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.]]></description>
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<title><![CDATA[Semiconductor test terminology guide aims to clarify docking and handling ops]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/07/semiconductor-test-terminology-guide-aims-to-clarify-docking-and-handling-ops.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/07/semiconductor-test-terminology-guide-aims-to-clarify-docking-and-handling-ops.html</guid>
<pubDate><![CDATA[Tue, 17 Jul 2012 17:16:00 EDT]]></pubDate>
<description><![CDATA[SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the “accuracy and efficiency of using, buying and servicing docking and handling equipment.”]]></description>
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<title><![CDATA[Epson launches high-throughput IC test handler for volume test]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/07/epson-launches-high-throughput-ic-test-handler-for-volume-test.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/07/epson-launches-high-throughput-ic-test-handler-for-volume-test.html</guid>
<pubDate><![CDATA[Mon, 02 Jul 2012 15:38:00 EDT]]></pubDate>
<description><![CDATA[Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.]]></description>
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<title><![CDATA[Advantest tackles 3D package test with new product line]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/06/advantest-tackles-3d-package-test-with-new-product-line.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/06/advantest-tackles-3d-package-test-with-new-product-line.html</guid>
<pubDate><![CDATA[Fri, 08 Jun 2012 15:00:00 EDT]]></pubDate>
<description><![CDATA[Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.]]></description>
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<title><![CDATA[Multitest delivers MEMS testing for pick-and-place set ups]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2012/03/multitest-delivers-mems-testing-for-pick-and-place-set-ups.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2012/03/multitest-delivers-mems-testing-for-pick-and-place-set-ups.html</guid>
<pubDate><![CDATA[Mon, 12 Mar 2012 10:25:00 EDT]]></pubDate>
<description><![CDATA[Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.]]></description>
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<title><![CDATA[Multitest test contactor suits large-array, high-pin-count digital chip test]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/03/multitest-test-contactor-suits-large-array-high-pin-count-digital-chip-test.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/03/multitest-test-contactor-suits-large-array-high-pin-count-digital-chip-test.html</guid>
<pubDate><![CDATA[Fri, 02 Mar 2012 14:19:00 EST]]></pubDate>
<description><![CDATA[Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.]]></description>
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<title><![CDATA[High-temp area-array package test sockets suit military, geophysical apps]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2011/12/high-temp-area-array-package-test-sockets-suit-military-geophysical-apps.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2011/12/high-temp-area-array-package-test-sockets-suit-military-geophysical-apps.html</guid>
<pubDate><![CDATA[Tue, 20 Dec 2011 09:31:00 EST]]></pubDate>
<description><![CDATA[Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200°C.]]></description>
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<title><![CDATA[Microsemi taps Amkor for SoC package test]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2011/11/microsemi-taps-amkor-for-soc-package-test.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2011/11/microsemi-taps-amkor-for-soc-package-test.html</guid>
<pubDate><![CDATA[Mon, 14 Nov 2011 07:57:00 EST]]></pubDate>
<description><![CDATA[Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.]]></description>
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<title><![CDATA[Multitest wins gravity test handler order for leaded and leadless package test]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2011/10/multitest-wins-gravity-test-handler-order-for-leaded-and-leadless-package-test.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2011/10/multitest-wins-gravity-test-handler-order-for-leaded-and-leadless-package-test.html</guid>
<pubDate><![CDATA[Thu, 06 Oct 2011 16:44:00 EDT]]></pubDate>
<description><![CDATA[Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.]]></description>
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