http://www.electroiq.com/articles/ap/2012/01/hitachi-chemical-claims-die-bonding-film-patent-violation.html http://www.electroiq.com/articles/ap/2011/12/copper-wire-bonding-offered-from-quik-pak.html http://www.electroiq.com/articles/ap/2011/02/hitachi-chemical-henkel-die-attach-film-license.html http://www.electroiq.com/articles/sst/print/volume-52/issue-10/Columns/Editorial/Welcome_to_ElectroIQ_.html http://www.electroiq.com/articles/sst/2008/07/vote-participate-in-the-sixth-annual-attendees-choice-awards.html http://www.electroiq.com/articles/ap/print/volume-17/issue-5/departments/product-preview/semicon-west-product-preview.html http://www.electroiq.com/articles/ap/print/volume-17/issue-4/features/inside-3d-packaging/enabling-next-generation-stacked-die-applications.html http://www.electroiq.com/articles/cr/2008/03/touchmark-and-quik-pak-attain-iso-90012000-certification.html http://www.electroiq.com/articles/sst/print/volume-50/issue-11/products/new-products.html http://www.electroiq.com/articles/ap/print/volume-16/issue-8/departments/new-products/new-products.html