<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0">
<channel>
<title><![CDATA[RSS for Dry Etching]]></title>
<description><![CDATA[Dry Etching news and technical articles from Solid State Technology Magazine. Search Dry Etching latest and archived news and articles]]></description>
<link><![CDATA[http://www.electroiq.com/topics/]]></link>
<atom:link xmlns:atom="http://www.w3.org/2005/Atom" type="application/rss+xml" rel="self" href="http://www.electroiq.com/topics/urss?pageid=488298"/>
<item>
<title><![CDATA[SAMCO to relocate and expand Silicon Valley office]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/04/samco-to-relocate-and-expand-silicon-valley-office.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/04/samco-to-relocate-and-expand-silicon-valley-office.html</guid>
<pubDate><![CDATA[Mon, 22 Apr 2013 17:56:00 EDT]]></pubDate>
<description><![CDATA[SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.]]></description>
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<title><![CDATA[AMEC develops process technology for dry etching at 20nm]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/04/amec-develops-process-technology-for-dry-etching-at-20nm.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/04/amec-develops-process-technology-for-dry-etching-at-20nm.html</guid>
<pubDate><![CDATA[Wed, 10 Apr 2013 14:04:00 EDT]]></pubDate>
<description><![CDATA[Advanced Micro-Fabrication Equipment Inc. (AMEC) said today that it has developed a Single-Station Chamber Advanced Dielectric Etcher (SSC AD-RIE) capable of processing the most rigorous semiconductor applications.]]></description>
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<title><![CDATA[Nanoplas introduces a new class of dry-etching technology]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/03/nanoplas-introduces-a-new-class-of-dry-etching-technology-.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2013/03/nanoplas-introduces-a-new-class-of-dry-etching-technology-.html</guid>
<pubDate><![CDATA[Thu, 14 Mar 2013 13:26:00 EDT]]></pubDate>
<description><![CDATA[Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.]]></description>
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<title><![CDATA[GlobalFoundries to fab Sand 9's MEMS timing products]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2012/10/globalfoundries-to-fab-sand-9s-mems-timing-products.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2012/10/globalfoundries-to-fab-sand-9s-mems-timing-products.html</guid>
<pubDate><![CDATA[Tue, 02 Oct 2012 15:34:00 EDT]]></pubDate>
<description><![CDATA[Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).]]></description>
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<title><![CDATA[LED manufacturing equipment status report]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/06/led-manufacturing-equipment-status-report.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/06/led-manufacturing-equipment-status-report.html</guid>
<pubDate><![CDATA[Thu, 21 Jun 2012 11:43:00 EDT]]></pubDate>
<description><![CDATA[To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather ...]]></description>
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<title><![CDATA[AVS Symposium 2011: A pre-show highlight reel]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2011/10/avs-symposium-2011-a-preshow-highlight-reel.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2011/10/avs-symposium-2011-a-preshow-highlight-reel.html</guid>
<pubDate><![CDATA[Tue, 11 Oct 2011 11:59:00 EDT]]></pubDate>
<description><![CDATA[Heading to the AVS Symposium later this month (Oct. 30-Nov. 4) in Nashville, TN? We've scanned the program to pick out some of the sessions that are of interest.]]></description>
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<title><![CDATA[IBM, ETH Zurich nanotechnology research center opens -- custom-built for nanoscience research]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2011/05/ibm-eth-zurich-nanotechnology-research-center-opens-custom-built-for-nanoscience-research.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2011/05/ibm-eth-zurich-nanotechnology-research-center-opens-custom-built-for-nanoscience-research.html</guid>
<pubDate><![CDATA[Wed, 18 May 2011 10:00:00 EDT]]></pubDate>
<description><![CDATA[The Binnig and Rohrer Nanotechnology Center opened at IBM (NYSE: IBM) Research - Zurich. The building represents an investment of $60 million in infrastructure costs and an additional $30 million for tooling and equipment. Six noise-free labs shield extremely sensitive experiments from external ...]]></description>
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<title><![CDATA[Graphene's journey from lab to foundry]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2011/03/graphene-journey-from-lab-to-foundry.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2011/03/graphene-journey-from-lab-to-foundry.html</guid>
<pubDate><![CDATA[Wed, 30 Mar 2011 12:46:00 EDT]]></pubDate>
<description><![CDATA[Technology, not physics, represents the major hurdle to allow graphene to step out of the lab and pave the way to the future of technology: either alone, or hand-in-hand with silicon. Mirco Cantoro, imec, enumerates graphene’s challenges and potential in microelectronics, high-speed/HF electronics, ...]]></description>
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<title><![CDATA[Japan infrastructure fab status after earthquake]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2011/03/japan-infrastructure-fab-status-after-earthquake.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2011/03/japan-infrastructure-fab-status-after-earthquake.html</guid>
<pubDate><![CDATA[Thu, 17 Mar 2011 14:20:00 EDT]]></pubDate>
<description><![CDATA[Live from Japan, longtime semiconductor exec Takeshi Hattori describes the situation facing semiconductor fabs -- and why power blackouts are the real problem, not earthquake or tsunami damage.]]></description>
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<title><![CDATA[Cell assembly: Low cost, continuous and ecological foil cleaning process for photovoltaics]]></title>
<link><![CDATA[http://www.electroiq.com/articles/pvw/2010/08/cell-assembly__low.html]]></link>
<guid>http://www.electroiq.com/articles/pvw/2010/08/cell-assembly__low.html</guid>
<pubDate><![CDATA[Tue, 03 Aug 2010 14:50:40 EDT]]></pubDate>
<description><![CDATA[Atmospheric plasma cleaning protocols are gaining early adoption within thin film PV foil cleaning processes, with some of the key drivers being its use of a continuous, R2R process, significantly lower production floor footprint, and lower capital cost. The highly efficient method for removing ...]]></description>
</item>
</channel>
</rss>
