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<description><![CDATA[Test System news and technical articles from Solid State Technology Magazine. Search Test System latest and archived news and articles]]></description>
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<title><![CDATA[Printed electronics sector takes hard look at the flexible future]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2013/03/printed-electronics-sector-takes-hard-look-at-the-flexible-futur.html]]></link>
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<pubDate><![CDATA[Tue, 12 Mar 2013 12:45:00 EDT]]></pubDate>
<description><![CDATA[The flexible and printed electronics community reports encouraging progress in the materials and process ecosystem needed for commercial production — and an increasingly realistic focus on applications that best capitalize on the technology’s strengths. Best near-term prospects now look to be ...]]></description>
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<title><![CDATA[Dreaming of plug-and-play IP]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/12/dreaming-of-plug-and-play-ip.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/12/dreaming-of-plug-and-play-ip.html</guid>
<pubDate><![CDATA[Mon, 17 Dec 2012 16:44:00 EST]]></pubDate>
<description><![CDATA[Stephen Pateras, product marketing director for Mentor Graphics Silicon Test products, blogs about the new IJTAG standard, which enables "plug and play" automation for SoC design.]]></description>
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<title><![CDATA[Cascade Microtech touts wafer-level test innovators at inaugural Innovation Awards]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/07/cascade-microtech-touts-wafer-level-test-innovators-at-inaugural-innovation-awards.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/07/cascade-microtech-touts-wafer-level-test-innovators-at-inaugural-innovation-awards.html</guid>
<pubDate><![CDATA[Fri, 27 Jul 2012 09:22:00 EDT]]></pubDate>
<description><![CDATA[Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.]]></description>
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<title><![CDATA[Spirent MEMS sensor simulator tests sensor fusion algorithms]]></title>
<link><![CDATA[http://www.electroiq.com/articles/stm/2012/07/spirent-mems-sensor-simulator-tests-sensor-fusion-algorithms.html]]></link>
<guid>http://www.electroiq.com/articles/stm/2012/07/spirent-mems-sensor-simulator-tests-sensor-fusion-algorithms.html</guid>
<pubDate><![CDATA[Tue, 17 Jul 2012 17:52:00 EDT]]></pubDate>
<description><![CDATA[Spirent Communications launched its new SimSENSOR sensor simulation software, enabling R&D technicians to test sensor fusion algorithms in navigation systems that include MEMS inertial sensors and multi-GNSS.]]></description>
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<title><![CDATA[MLCC manufacturers order ESI high-throughput test system]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/07/mlcc-manufacturers-order-esi-high-throughput-test-system.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/07/mlcc-manufacturers-order-esi-high-throughput-test-system.html</guid>
<pubDate><![CDATA[Tue, 03 Jul 2012 10:52:00 EDT]]></pubDate>
<description><![CDATA[Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.]]></description>
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<title><![CDATA[FormFactor probe card tests SoCs]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/06/formfactor-probe-card-tests-socs.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/06/formfactor-probe-card-tests-socs.html</guid>
<pubDate><![CDATA[Thu, 07 Jun 2012 00:13:00 EDT]]></pubDate>
<description><![CDATA[FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.]]></description>
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<title><![CDATA[Flash memory maker orders additional Aehr full-wafer test tool]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/06/flash-memory-maker-orders-additional-aehr-full-wafer-test-tool.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/06/flash-memory-maker-orders-additional-aehr-full-wafer-test-tool.html</guid>
<pubDate><![CDATA[Tue, 05 Jun 2012 11:00:00 EDT]]></pubDate>
<description><![CDATA[Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.]]></description>
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<title><![CDATA[Advantest DRAM test system clocks 8Gbps test speed on every pin]]></title>
<link><![CDATA[http://www.electroiq.com/articles/sst/2012/05/advantest-dram-test-system-clocks-8gbps-test-speed-on-every-pin.html]]></link>
<guid>http://www.electroiq.com/articles/sst/2012/05/advantest-dram-test-system-clocks-8gbps-test-speed-on-every-pin.html</guid>
<pubDate><![CDATA[Mon, 14 May 2012 16:49:00 EDT]]></pubDate>
<description><![CDATA[Advantest Corporation uncrated the next-generation high-speed DRAM test system, T5511, offering 8Gbps test speed. It can be deployed from R&D through to volume production.]]></description>
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<title><![CDATA[Ultratech brings former member back to Board]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/04/ultratech-brings-former-member-back-to-board.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/04/ultratech-brings-former-member-back-to-board.html</guid>
<pubDate><![CDATA[Thu, 19 Apr 2012 08:39:00 EDT]]></pubDate>
<description><![CDATA[Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech’s Board in the 1990s.]]></description>
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<title><![CDATA[Burn-in and test system offers device-by-device temperature control]]></title>
<link><![CDATA[http://www.electroiq.com/articles/ap/2012/04/burn-in-and-test-system-offers-device-by-device-temperature-control.html]]></link>
<guid>http://www.electroiq.com/articles/ap/2012/04/burn-in-and-test-system-offers-device-by-device-temperature-control.html</guid>
<pubDate><![CDATA[Mon, 16 Apr 2012 13:08:00 EDT]]></pubDate>
<description><![CDATA[Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.]]></description>
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