Underfill
Underfill news and technical articles from Solid State Technology Magazine. Search Underfill latest and archived news and articles
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LORD underfill encapsulant designed for lower cost
… supplier, launched the ME-555 underfill encapsulant for semiconductor ..... semiconductor-grade epoxy underfill for encapsulating flip chips ..... lower-cost than competitive underfill materials, the company said ..... statement, comparing it to underfills such as Henkel 4256 . The …
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Henkel underfill boasts high Tg for WLCSP and PoP devices
… Henkel developed LOCTITE UF3810 underfill for high reliability and ease ..... The material flows fast and underfills at room temperature, curing ..... solder-compatible. The underfill offers drop and shock protection ..... Henkel’s next-generation underfills , log on to www.henkel …
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Halogen-free underfill uncrated at Henkel
… reworkable epoxy capillary underfill with a high glass transition ..... applications. This high Tg underfill also provides enhanced thermal ..... with other low T g reworkable underfills . It cures quickly at moderate ..... thermal cycling protection. The underfill , as well as lead-free solders …
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Zymet PoP underfill offers lower viscosity, CTE for finer pitches
… Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package ..... PoP) assemblies. Figure. Void-free underfill of 0.4-mm pitch POP with CN-1736. The underfill boasts low viscosity and a lower CTE than …
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Underfill , wafer-level dielectrics, Cu-compatible resins among packaging material winners
… higher growth in certain areas, including underfill materials, wafer-level dielectrics, copper ..... density packages, no-flow or wafer-applied underfill for flip chips, reworkable underfill , thermally conductive die attach films (DAF …
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Advanced packaging in the new decade
… new formulations of materials such as underfill and mold compounds. Fast forward to ..... may change the type of bumps used, the underfill materials, substrate materials and construction ..... leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die …
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One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs
… control for semiconductor packaging applications such as flip chip underfill , chip scale packages (CSP), ball grid arrays (BGA), package-on-package (PoP) underfill , precise coating, and adhesive dispensing. The Genius Jet Cartridge …
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Reworkable edgebond adhesive improves CBGA and BGA thermal cycle performance
… a CBGA, to nearly 2500 cycles. Previously, underfill was needed to achieve this level of performance ..... edgebond adhesive is easier to process than an underfill . When applying underfill , the printed circuit board (PCB) is preheated …
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22nm requires foundry-to-packaging-house cooperation
… molding compounds. For devices that were flip chip bonded, underfill materials had to be modified. At the 22nm technology node ..... New material formulations will be required, especially for underfill . Potentially, packaging houses will need to change the assembly …
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Altera taps Amkor for molded flip chip packaging of FPGA family
… FCmBGA packages use an exposed die configuration with a molded support for direct attach of a heatsink. It uses molded underfill (MUF). The design maintains coplanarity without a lid, preventing damage during system-level assembly, reducing package …
