Tim
Tim news and technical articles from Solid State Technology Magazine. Search Tim latest and archived news and articles
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Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
… Simulation software shows specific sections of the design that correspond to the measured structure. Thermal interface materials ( TIMs ) are difficult to model since their conductivity and thickness cannot be determined with high accuracy, so thermal package …
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
… liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials ( TIMs ). The findings in the report are based on more than 140 indepth interviews conducted with packaging subcontractors, semiconductor …
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Heraeus thick film division renames insulated aluminum materials system Celcion
… system allows circuits to be built directly onto aluminum substrates, eliminating the need for thermal interface materials ( TIMs ). This allows Celcion circuits to run 10°C cooler than MCPCBs. Also read: LED test standards, packaging material challenges …
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Reducing mask write-time—which strategy is best?
Steffen Schulze and Tim Lin, Mentor Graphics, Wilsonville, OR ..... mail steffen_schulze@mentor.com . Tim Lin is technical marketing engineer for ..... 94538; ph ph 800/547-3000, e-mail tim _lin@mentor.com . Solid State Technology …
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ISS day 2: Cloud computing to drive 450mm, closer collaboration
… Patterning, CVD/ALD and CMP will drive the materials demand growth. The PV materials demand is forecast to be $25B by 2015. Tim Hendry, VP of Intel’s Technology & Manufacturing Group, addressed the advanced products that are enabled by materials development …
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Skyline Solar unveils CPV technology at SPI, chats about subsidies
October 18, 2011 -- Tim Keating, VP of marketing and field operations at Skyline Solar, recently discussed the company’s new glass-and-silicon …
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Is PC softness dragging down Intel's 22nm plans?
… Ireland (the '1270' line) is being removed from the company's 22nm roadmap, according to Barclays' CJ Muse. Citi's Tim Arcuri added that the planned Fab 24 migration is being put "on hold" with a deeper strategic decision over Fab 24's fate …
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Analyst: $10B more semi capex thanks to tablets, smartphones
… three years, roughly the equivalent of two new fabs a year and $10B in annual capex, says a Wall Street analyst. Citi's Tim Arcuri bases his conclusion on a number of calculations: -- Smartphone units will double by 2013 to ~1B annual shipments …
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Georgia Tech targets thin 3D packaging with new consortium
… package-to-package interconnections; novel thermal solutions for embedded thin die eliminating thermal interface materials ( TIM ); 15µm pitch die-to-package Cu-Cu I/Os with high current carrying capability; ultra-slim substrates with low warpage …
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Chinese solar financials show ups and downs in 4Q11-1Q12
… all about input costs," writes Citi's Tim Arcuri, pointing out that sinking polysilicon ..... Jesse Pichel from Jefferies. (Citi's Tim Arcuri pointed out that Yingli "continues ..... note Jefferies' Jesse Pichel and Citi's Tim Arcuri. Maxim Group analyst Aaron Chew …
