Thin Package
Thin Package news and technical articles from Solid State Technology Magazine. Search Thin Package latest and archived news and articles
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PACKAGING BEAT: Substrates, thin packaging highlight ITRS changes
… Difficult Challenges" table has been updated, with the most noticeable changes in the issues associated with substrates and thin packaging . For substrates, one item added to the list is a need for solutions to meet the I/O density of the latest area-array …
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Updates on folded flex and thin packaging at ICAPS
IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno
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2007 Finalist Showcase
… die bonding down to 1-mil die thickness for ultra- thin packaging . It offers strategic die-picking algorithms with a proprietary ..... compression. A low-stress additive prevents warpage in thin packages . Package benefits include tighter dimensional tolerances …
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Tooling and process technology vital for thin packages
… processes at 22nm RoHS, device shrinks will continue to drive packaging technology Tooling and process technology vital for thin packages More collaboration is needed to improve process integration 22nm brings maskmakers, end users closer 22nm: The era of wafer …
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The back-end process: Step 3 - Wafer backgrinding
… wafers, bumped wafers, stacked die requirements and ultra- thin packages , wafer backgrinding equipment and processes are becoming ..... must be ultra thin or if multiple die must be stacked in a thin package , then there is little alternative but to go with the chemical …
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RF Components and Devices in 3D LCP Package
… word encompassing die, dielectric, passives, and ultimately resulting in thin packages . This series of articles will overview trends from thick to thin packages with embedded RF passive and active components within a flexible microwave organic …
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Thin Wafer Processing
… thin and ultrathin semiconductor devices grows continuously. Discrete and bipolar IC's as well as devices for stacking or thin packages require thinner and thinner wafers. The challenge is to find a reliable processing method. Not all thin wafer applications …
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STATS ChipPAC Expands QFN Portfolio
… version for applications requiring increased design flexibility and higher input/output (I/O) performance in a small, thin package profile. The new QFN package family, referred to as QFNs-se, reportedly features a higher number of very thin I/O …
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Flip Chip Goes 3D
By Daniel F. Baldwin, Ph.D. and Paul Houston, ENGENT, Inc. With advances in wafer-thinning technology, 3D packaging now provides a robust platform for achieving high levels of integration, small package footprints, and thin package profiles. Further component miniaturization with the added benefit ...
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The APAs: Honoring Industry Innovation
… on-wires (FOW) stacking, in one module; it also performs thin die bonding down to 1-mil die thickness for ultra- thin packaging . It offers strategic die-picking algorithms with a proprietary ejector system for such applications. The combination …
