Home>Topics>Thin Package
  1. All
  2. Online Articles
  3. Magazine Articles

Thin Package

Thin Package news and technical articles from Solid State Technology Magazine. Search Thin Package latest and archived news and articles

  1. PACKAGING BEAT: Substrates, thin packaging highlight ITRS changes

    Online Articles

    Tue, 30 Jan 2007

    Difficult Challenges" table has been updated, with the most noticeable changes in the issues associated with substrates and thin packaging . For substrates, one item added to the list is a need for solutions to meet the I/O density of the latest area-array

  2. Updates on folded flex and thin packaging at ICAPS

    Magazine Articles

    Wed, 1 May 2002

    IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno

  1. 2007 Finalist Showcase

    Magazine Articles

    Sun, 1 Jul 2007

    die bonding down to 1-mil die thickness for ultra- thin packaging . It offers strategic die-picking algorithms with a proprietary ..... compression. A low-stress additive prevents warpage in thin packages . Package benefits include tighter dimensional tolerances

  2. Tooling and process technology vital for thin packages

    Online Articles

    Tue, 11 Jan 2011

    processes at 22nm RoHS, device shrinks will continue to drive packaging technology Tooling and process technology vital for thin packages More collaboration is needed to improve process integration 22nm brings maskmakers, end users closer 22nm: The era of wafer

  3. The back-end process: Step 3 - Wafer backgrinding

    Magazine Articles

    Fri, 1 Mar 2002

    wafers, bumped wafers, stacked die requirements and ultra- thin packages , wafer backgrinding equipment and processes are becoming ..... must be ultra thin or if multiple die must be stacked in a thin package , then there is little alternative but to go with the chemical

  4. RF Components and Devices in 3D LCP Package

    Online Articles

    Mon, 4 Aug 2008

    word encompassing die, dielectric, passives, and ultimately resulting in thin packages . This series of articles will overview trends from thick to thin packages with embedded RF passive and active components within a flexible microwave organic

  5. Thin Wafer Processing

    Online Articles

    Mon, 2 Mar 2009

    thin and ultrathin semiconductor devices grows continuously. Discrete and bipolar IC's as well as devices for stacking or thin packages require thinner and thinner wafers. The challenge is to find a reliable processing method. Not all thin wafer applications

  6. STATS ChipPAC Expands QFN Portfolio

    Online Articles

    Mon, 24 Nov 2008

    version for applications requiring increased design flexibility and higher input/output (I/O) performance in a small, thin package profile. The new QFN package family, referred to as QFNs-se, reportedly features a higher number of very thin I/O

  7. Flip Chip Goes 3D

    Online Articles

    Tue, 6 May 2008

    By Daniel F. Baldwin, Ph.D. and Paul Houston, ENGENT, Inc. With advances in wafer-thinning technology, 3D packaging now provides a robust platform for achieving high levels of integration, small package footprints, and thin package profiles. Further component miniaturization with the added benefit ...

  8. The APAs: Honoring Industry Innovation

    Magazine Articles

    Wed, 1 Aug 2007

    on-wires (FOW) stacking, in one module; it also performs thin die bonding down to 1-mil die thickness for ultra- thin packaging . It offers strategic die-picking algorithms with a proprietary ejector system for such applications. The combination

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS