Thin Package
Thin Package news and technical articles from Solid State Technology Magazine. Search Thin Package latest and archived news and articles
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STATS ChipPAC brings FOWLP to stacked packages for
… below 1.0mm. The PoP format aims for higher thermal and electrical performance, increased bandwidth and speed in an ultra thin package profile, with design flexibility in integrating memory and logic semiconductors. Industry standard is 1.4mm total stacked …
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Amkor PoP tech surpasses 100M units
… without new surface mount stacking infrastructure development, or added cost. Amkor notes the technology's low warpage, thin package profile, fine pitch, and compatibility with wirebond and flip chip interconnects. The TMV PoP supports stacked die or …
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Invensas demos DFD implementation of its xFD technology
… the substrate. This gives an electrical advantage: "Because we remove spacers and face-up wirebonds, you get a super thin package that aids in heat transfer," he said. "And because you've staggered the die, you get heat transfer through the bottom …
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Invensas demos DFD implementation of its xFD technology
… Simon McElrea. This gives an electrical advantage: "Because we remove spacers and face-up wire bonds, you get a super thin package that aids in heat transfer," he said. "And because you've staggered the die, you get heat transfer through the bottom …
