Thin Device
Thin Device news and technical articles from Solid State Technology Magazine. Search Thin Device latest and archived news and articles
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New Method to Form Ultra-Thin Device Wafers
… Inc. (CTI) announced a new method for forming ultra- thin device wafers that is less expensive and more uniform than ..... process. "ThinMOS provides the solution to form ultra- thin device substrates for a variety of applications. Reducing package …
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EVGroup Announces Bonder Install
… by an Austrian semiconductor manufacturer. They system, designed for high-volume processing of thin- and ultra- thin device wafers, reportedly allows secure and reliable handling of high-value wafers while contributing to higher yield.
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Lithography and wafer bonding solutions for 3D integration
… Lithography on the backside of the thin device wafer requires alignment of the ..... Therefore, small via diameters require thin device wafers. Figure 1 shows the generic ..... polishing, the backside of the thin device wafer has to be patterned with …
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Temporary bonding/debonding for ultrathin substrates
… applied to the wafer stack, and the thin device wafer is then debonded from the ..... fast and reliable debonding of the thin device wafer from the carrier, followed ..... the wafer edge, and prevent the thin device wafer from bending or warping …
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Handling Ultra-thin Wafers
… attraction between a mobile electrostatic carrier and a thin device wafer. Click here to enlarge image Semiconductor materials ..... by the electrical fields between the backside of the thin device wafer and the electrode areas of the carrier substrate …
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PRODUCT NEWS
… etching, plating, annealing, and cleaning, to generate through-hole via structures and redistribution layers on the thin device wafer. This achievement is reportedly key to enabling 3D stacking of devices, which is needed to produce multifunctional …
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Brewer Science, EV Group debut bonding combo for ultrathin wafers
… etching, plating, annealing and cleaning, to generate through-hole via structures and redistribution layers on the thin device wafer, the company says. Brewer says the material has processing capability >200 deg.C with "broad" chemical …
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Advanced Packaging Award Finalist Showcase
… channels, four NANO-connectors, built-in intelligence, and a “go/no-go” indicator. This 7.2-mm thin device includes MEGAM.O.L.E. MAP software features three workflow wizards, Target-10 profile validation, and over 180 …
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Automated handling of ultra-thin silicon wafers
… 5]. A segment of the semiconductor industry is paying increasing attention to special needs for the production of thin device wafers. In addition to Semi meetings, several technical meetings have been held and more are envisioned to address …
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The future of SOI and strained Si
… more from the stressing media because the placement of a thin device silicon film on a more elastic, buried oxide film would ..... will likely employ FD SOI devices that require extremely thin device films, and if those were to rely on strain built into …
