Thermal Interface Material
Thermal Interface Material news and technical articles from Solid State Technology Magazine. Search Thermal Interface Material latest and archived news and articles
-
APNT's new thermal interface materials meet power semiconductors' reqs
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.
-
Georgia Tech targets thin 3D packaging with new consortium
… profile package-to-package interconnections; novel thermal solutions for embedded thin die eliminating thermal interface materials (TIM); 15µm pitch die-to-package Cu-Cu I/Os with high current carrying capability; ultra …
-
Advanced packaging in the new decade
… materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials . Many IC makers have noticed that the cost of packaging devices is increasing rapidly, impacting margin …
-
Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
… Simulation software shows specific sections of the design that correspond to the measured structure. Thermal interface materials (TIMs) are difficult to model since their conductivity and thickness cannot be determined with high accuracy …
-
Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
… materials $697 Solder balls $494 WLP dielectrics $68 Thermal interface materials $537 SEMI and TechSearch International's Global ..... solder balls, wafer level package dielectrics, and thermal interface materials (TIMs). The findings in the report are based on …
-
-
Heraeus thick film division renames insulated aluminum materials system Celcion
… MCPCBs. The system allows circuits to be built directly onto aluminum substrates, eliminating the need for thermal interface materials (TIMs). This allows Celcion circuits to run 10°C cooler than MCPCBs. Also read: LED test standards …
-
Honeycomb heatsink cools BGAs in thin-profile devices
… Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages, depending on the thermal interface material (TIM). The design is studded with holes, helping increase surface area and cross ventilation. Ambiant …
