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The JEDEC Solid State Technology Association published a significant revision to JESD9B, Inspection Criteria for Microelectronic Packages and Covers.
DCG acquired Thermosensorik GmbH, a leading provider of infrared non-destructive testing (IR NDT) products for the semiconductor, photovoltaic, and weld inspection markets.
Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.
David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.
Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.
Todd Fries, HellermannTyton, describes recent fire and electrical codes that affect solar photovoltaics (PV) installations, debunking some myths and describing what installers need to know to pass inspection and properly label PV systems.
Nordson Corporation (NASDAQ:NDSN) opened a demo center in Dongguan, China for customers of its Advanced Technology Systems operating segment: Nordson ASYMTEK, Nordson DAGE, and Nordson YESTECH brands.
KLA-Tencor (KLAC) debuted an integrated product to help solar photovoltaics (PV) cell manufacturers improve production yield. FabVision Solar captures all the measurement inspection data throughout the manufacturing process including measured data, images, and defect information, according to David
Multiest released data from an international IDM's high-volume production site, tracking its DuraKelvin test contactor's FPY and cleaning downtime.
Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.