System On Package
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GA Tech's Rao Tummala recognized with major IEEE packaging award
… as the "packaging bible" to practitioners. While at Georgia Tech he introduced and developed the concept of system - on - package (SOP). Other IEEE ECTC award recipients include: 2011 IEEE CPMT Outstanding Sustained Technical Contribution …
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EV Group joins Ga. Tech's 3D packaging center
… proven equipment and comprehensive process know-how will enable EVG to greatly contribute to our pioneering system - on - package technology research and development," stated PRC Director Professor Rao R. Tummala. (He was recently recognized …
