System On Package
System On Package news and technical articles from Solid State Technology Magazine. Search System On Package latest and archived news and articles
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3D Jargon – Getting it Straight
… via (TSV), 3D packaging, 3D TSV, 3D system-in-package (SiP), 3D system-on-chip (SoC), and 3D system - on - package (SoP) are some of the hottest topics presented at conferences to standing-room only audiences or read about …
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John Knickerbocker, IBM
John Knickerbocker, distinguished engineer and manager, system on package & 3D integration at IBM, is interviewed by SST senior technical editor, Debra Vogler. He discusses how 3D integration is unfolding at IBM over the next five years. The company will have its first 3D product rolling out in ...
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Why SATS consolidation needs to happen
… require both processes and technologies for packaging and printed circuit board assembly -- and technologies such as system - on - package will further blur these roles. SATS firms should expect to see increased competition from the foundry market …
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GA Tech's Rao Tummala recognized with major IEEE packaging award
… as the "packaging bible" to practitioners. While at Georgia Tech he introduced and developed the concept of system - on - package (SOP). Other IEEE ECTC award recipients include: 2011 IEEE CPMT Outstanding Sustained Technical Contribution …
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EV Group joins Ga. Tech's 3D packaging center
… proven equipment and comprehensive process know-how will enable EVG to greatly contribute to our pioneering system - on - package technology research and development," stated PRC Director Professor Rao R. Tummala. (He was recently recognized …
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In the News
… panels on 3-D packaging, system - on - package (SoP), MEMS, and chip ..... image Sharing his vision for system - on - package (SoP), a 3-D integration ..... and Packaging Technologies: System - on - Package ,” on March 13, 2006. The PRC …
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RF Components and Devices in 3D LCP Package
… Xinzhong, Z. Li-Rong, E. Tjukanoff,; H. Tenhunen, "Chip-package co-design of a concurrent LNA in system - on - package for multi-band radio applications", Electronic Packaging and Technology Conference, Volume 2, June 2004, pp …
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Laser Applications in Advanced IC Packaging
… likely yield the results necessary to drive commercialization efforts. Pilot production of a variety of memory and system - on - package (SoP) technologies has recently been seen in the marketplace. 2 This 3D methodology uses, among other techniques …
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Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference (IWLPC)
… Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering system - on - package (SoP) vision, since 1994. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies …
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In the News
… into the second law, the “System Integration Law,” wherein IC, package, and board integrate, forming a system - on - package (SoP). He referred to this next step in device packaging as a move from multifunctional devices to megafunctional products …
