Surface Preparation
Surface Preparation news and technical articles from Solid State Technology Magazine. Search Surface Preparation latest and archived news and articles
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LED maker orders multiple fab tools from OEM Group
… Spray Acid Tool (SAT) semi-automated batch surface preparation systems from OEM Group’s Cintillio product line ..... Lam AutoEtch, and Applied Materials/Semitool surface preparation equipment and processes. Its Classics equipment …
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Defect removal using dry cryogenic aerosols
… Electromechanical Society Proceedings Series, Pennington, NJ (2001). 5. J. M. Lauerhaas, 2007 SEMATECH Surface Preparation and Cleaning Conference (2007). Dr. Jeffery W. Butterbaugh is currently Chief Technologist and Director of …
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Lam Research acquiring Novellus in all-stock deal
… Lam specializes in wafer etch and single-wafer clean equipment. Novellus provides thin-film deposition and surface preparation technologies. The combined company will target semiconductor manufacturers' needs in 3D structures and scaling …
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memsstar expands in Silicon Glen
… memsstar expects the additional capacity will support its Solo, Sentry and Multi process tools for advanced etch, surface preparation and deposition processes to support MEMS R&D and volume manufacturing. The new facility layout also allows memsstar …
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SPIE BACUS: Delayed Photomask Japan 2011 in a nutshell
… Anna Tchoukoleva of GlobalFoundries presented a very interesting paper about the effect of MoSi mask absorber surface preparation on radiation durability in the wafer fab. For many years, the mask industry has worked to eliminate sulfates …
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Avantor, SACHEM selective etch chemisty doubles as wafer cleaner
… etchant was created through a joint development agreement between Avantor and SACHEM Inc., which covers specialty surface preparation and removal chemistries for thin-film wafer stacks. Avantor applied photoresist/residue removal technologies …
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Integration and 3D-ICs driving developments in wafer bonding
… and manufacturing approach that reduces design, test and manufacturing costs. Because of the improvements in surface preparation , mainly CMP and plasma activation, fusion wafer bonding has become a standardized process for heterogeneous integration …
