Surface Etching news and technical articles from Solid State Technology Magazine. Search Surface Etching latest and archived news and articles
precursors induce carbon contaminants in deposited films, and GeTe is no exception. Using XPS measurements with surface - etching capability, the presence of in-film carbon contamination can easily be seen ( Fig. 1 ). In this case, we found
fledgling semiconductor industry. By the mid-70s, so-called 'black' cells had been developed , where the use of surface etching to add texture gave them the appearance of black velvet. Green acknowledged that some companies had indeed implemented
Assisting in mask writing [30] (for subsequent metallization, secondary diffusion in selective emitters, or surface etching to texture); Localized secondary diffusion [31] (laser doping via phosphorous- or boron-contained precursor
Assisting in mask writing [18] (for subsequent metallization, secondary diffusion in selective emitters, or surface etching to texture); Localized secondary diffusion [19] (laser doping via phosphorous- or boron-contained precursor
Assisting in mask writing [30] (for subsequent metallization, secondary diffusion in selective emitters, or surface etching to texture); Localized secondary diffusion [31] (laser doping via phosphorous- or boron-contained precursor
Assisting in mask writing [18] (for subsequent metallization, secondary diffusion in selective emitters, or surface etching to texture); Localized secondary diffusion [19] (laser doping via phosphorous- or boron-contained precursor
excimer laser source has been qualified for a few years—for a different application to form a barrier for front- surface etching of poly-c-Si cells with improved light trapping. Excimer lasers have a strong track-record within laser-based
mixed-fluid jet approach to wafer cleaning that can produce up to 90 percent particle removal efficiency without surface etching . Photo courtesy of Applied Materials, Inc. Click here to enlarge image As for trends in mask cleaning, conference
tank design. The SC1 solution has been used for many years to remove particle contamination with a combination of surface etching and favorable pH. With the semiconductor industry moving to smaller gate linewidths, controlling the amount and
to aid in the transition from the 65nm to the 45nm technology node. Traditionally, pCMP cleaners have relied on surface etching to undercut and lift-off residues [3]. However, this often leads to grain-boundary decoration or selective