Surface Conditioning news and technical articles from Solid State Technology Magazine. Search Surface Conditioning latest and archived news and articles
The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.
Stacked-die-attach package applications require backside metal deposition for device contact within the package.
FSI International Inc. ( Nasdaq:FSII ), surface conditioning equipment supplier, won orders for multiple ORION ..... FSI International Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics
Chaska, MN - The surface conditioning division of FSI International ..... the advancement of low- k surface conditioning solutions, for use in processing ..... will use its ZETA 300 BE Surface Conditioning Systems and ANTARES CX Advanced
into Selete's 300mm program The on-going evaluation, since July 1999, of FSI International's ZETA 300mm surface conditioning system gives a good view into Japan's Selete 300mm tool selection program and the rigors of 300mm processing specifications
VDA, ISO-1997 and ANSI. Also read : Eliminating micro-cracks, crystal dislocations with single-wafer surface conditioning The instrument includes a 5.7" color LCD touchscreen display. After measurement is performed, a waveform with
molecular oxide-oxide bonding, surface conditioning , and wafer thinning. This ..... specific pre-bonding surface conditioning and post-bonding thermal ..... appropriate pre-bonding surface conditioning , high bonding energies compatible
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, will ship an ORION single wafer ..... FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics
activation have been integrated into modern bonding systems. This allows the highest possible repeatability of wafer surface conditioning . The main attractiveness of fusion wafer bonding is that the annealing can be performed as a batch process
wafer processing will see a greater impact than surface conditioning . Today's gate-first or gate-last architectures ..... already posing challenges to state-of-the-art surface - conditioning techniques, and the advent of a new generation