Subsystems And Components
Subsystems And Components news and technical articles from Solid State Technology Magazine. Search Subsystems And Components latest and archived news and articles
-
Knowles patents upheld against MemsTech
The US Court of Appeals for the Federal Circuit affirmed that MemsTech's importation and sale of certain MEMS microphone packages infringes Knowles Electronics LLC's US Patents 7,242,089 and 6,781,231.
-
Projected 23% CAGR in MEMS microphone market attracts crowd of entrants
SEMICON West preview: Companies are scrambling for a piece of the growing market of MEMS microphones for mobile phones, where applications are widening and demands are getting more sophisticated.
-
Omron shares MEMS dev at Sensors Expo
Omron's Micro Device Division (MDD) will release numerous MEMS products in the coming year, notably an absolute pressure sensor for high-accuracy navigation and a thermal IR sensing array for smart buildings and appliances.
-
JEDEC revises package inspection standard JESD9B
The JEDEC Solid State Technology Association published a significant revision to JESD9B, Inspection Criteria for Microelectronic Packages and Covers.
-
Benchtop vacuum degassing chamber aids slurry, epoxy, etc research
MV Products’ Portable Degassing Chamber is a compact degas vessel and vacuum foreline trap combination for degassing and deaeration of epoxies, gels, resins, slurries, and urethanes.
-
-
SINGULUS thin film solar cell tool cleans rear and sides in 1 step
The new tool simultaneously cleans back-sides and edges of thin film solar cells in a single step. It protects the active layer from etch by process hoods and performs pencil and rear side etching with brushes and chemicals.
-
Power management ICs for green energy applications
Executive Overview The power management IC (PMIC) has become a critical component in virtually every electronics product today. Much of this demand is being fueled by the global transition to green energy solutions. Highlighted will be a 0.18m BCDMOS process with 30V LDMOS transistors having an Rsp
-
Performance enhancements for multi-die DRAM packages
R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C
-
One year later: Amkor/TI high-density copper pillar bump technology
In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages—shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.
-
Edwards talks PV throughput, environmental improvements
Mike Allison, executive VP of Edwards, describes how solar photovoltaics (PV) manufacturers are looking to up productivity and drive the cost curve down, ever hunting the lowest cost/Watt.
