Substrates
Substrates news and technical articles from Solid State Technology Magazine. Search Substrates latest and archived news and articles
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Omron shares MEMS dev at Sensors Expo
Omron's Micro Device Division (MDD) will release numerous MEMS products in the coming year, notably an absolute pressure sensor for high-accuracy navigation and a thermal IR sensing array for smart buildings and appliances.
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Semiconductor industry executives: Can't miss events at SEMICON West
To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.
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Korean IDM orders NEXX tools for WLP metallization
NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.
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SINGULUS thin film solar cell tool cleans rear and sides in 1 step
The new tool simultaneously cleans back-sides and edges of thin film solar cells in a single step. It protects the active layer from etch by process hoods and performs pencil and rear side etching with brushes and chemicals.
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AMAT debuts DRAM fab tools for denser transistors
Applied Materials debuted 3 systems for next-generation DRAM chip manufacturing: the Applied Centura DPN HDTM system to improve the gate insulator scaling; the Applied Endura HAR Cobalt PVD system for high-aspect-ratio contact structures; and the Applied Endura Versa XLR W PVD system for reduced ...
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TSV moves to "real engineering," but reliability data needed
Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.
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Extending optical lithography with complementary e-beam lithography
David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.
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Power management ICs for green energy applications
Executive Overview The power management IC (PMIC) has become a critical component in virtually every electronics product today. Much of this demand is being fueled by the global transition to green energy solutions. Highlighted will be a 0.18m BCDMOS process with 30V LDMOS transistors having an Rsp
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Performance enhancements for multi-die DRAM packages
R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C
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One year later: Amkor/TI high-density copper pillar bump technology
In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages—shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.
