Sub Systems
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Georgia Tech targets thin 3D packaging with new consortium
… RF, digital and power modules in partnership with global companies. The goal is ultra-miniaturized heterogeneous sub - systems created using 3D integration of multiple ultra-slim packages with embedded thin active or passive components . Within …
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Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
… combined T3Ster hardware measurement and FloTHERM software simulation methodology optimizes heat management in devices, sub - systems and full systems. Component makers can optimize LED and IC package designs for effective heat dissipation. Device …
