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The Low-Pressure Plasma Processing Environment Vacuum Evaporation and Vacuum Deposition Physical Sputtering and Sputter Deposition (Sputtering) Arc Vapor Deposition Ion Plating and Ion Beam Assisted Deposition Atomistic Film Growth and Some
Ni film layer. The Ni film layer serves the solder layer is used as the joining layer on the electrode surface. Sputter deposition of Ni and solder not only provides soldering with solder paste and the same joining strength, but also makes it