Solder
Solder news and technical articles from Solid State Technology Magazine. Search Solder latest and archived news and articles
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ULVAC cuts gold from package-level solder deposition process with sputtering methods
… March 13, 2012 -- ULVAC Inc. developed solder deposition processes for silicon device ..... including power devices, that sputters solder to deposit it rather than printing or ..... substrates and provide heat sinks for solder joints. A typical deposition composition …
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One year later: Amkor/TI high-density copper pillar bump technology
… pitch up to 300% compared to then current solder bump flip chip technology. Very little ..... mobile phone applications. Traditional solder or Cu Pillar interconnect pitches have ..... routinely bumped at 140-180m pitch with 90m solder balls in area array. Advanced silicon …
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SATS providers order BTU reflow ovens in Asia
… processing equipment supplier, won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors ..... half of 2012. Major SATS companies require high-performance solder reflow ovens, commented Jim Griffin, vice president of sales …
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Leading-edge semiconductor materials research at TECHCON 2011
September 16, 2011 -- Whether it's lead-free solder for package assembly or graphene for new transistors, semiconductor ..... an electronics materials focus, is working on lead-free solder recipes that withstands repeated stresses better than today …
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Henkel power package sintering technology shuns Pb, pressure processing
… conductivity and resistance, and power cycling reliability than high-lead soft solders: power cycle testing showed that solder failed at 200 cycles and Henkel’s Ag sintering technology topped 2,000 cycles. Since the sintering process is lead …
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Invensas debuts high-I/O PoP semiconductor packaging design
… requirements in a small form factor. The ultra-high I/O offered by BVA exceeds what is possible with solder ball stacking and solder -filled laser via approaches, Invensas says. Invensas will present its BVA PoP solution at the Electronic …
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NXP increases pad pitch while shrinking package form factor
… a 0.3mm or 0.35mm pad pitch, which require step-down solder masks at board-level assembly. The larger pad pitch of the ..... contact area for less exacting component placement, improved solder joint strength and robustness, and reduced risk of short circuits …
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SEMATECH highlights from VLSI-TSA
… SEMATECH’s copper-to-copper direct bonding (CuDB) technology that can scale chip-to-chip interconnects beyond what solder can achieve in mechanical, electrical, thermal, and reliability performance. He also discussed recent progress and remaining …
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Invensas face-down die packaging replaces SODIMM
… International Conference on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan. Titled "A multi-die DRAM package for solder -down memory in Ultrabook and Tablet PC applications" and coauthored by Dell Inc., the paper will be part of the technical …
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Package-on-package: thinner, faster, denser
… passivation layers, typically required with solder FC; and Overall - enables smaller, thinner ..... pitch FC, copper pillars with lead-free solder cap (photos). Significant collaboration ..... pitch FC, copper pillars with lead-free solder cap (illustration). The future of PoP …
