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Solder

Solder news and technical articles from Solid State Technology Magazine. Search Solder latest and archived news and articles

  1. Solder Recovery from Dross in the EVS Booth at APEX

    Video

    Mon, 7 Mar 2011

    in manufacturing. It's used for wave solder process. We've machines in this otter ..... version Saturn that allows usually cut their solder consumption by forty to 50%. So when ..... also added is that you can add to the solder that help reclaim the the solder from

    Solder found at 0:20, 1:16, 3:07

    system. Doesn't use this machine in -- manufacturing. It's used for wave solder process. We've -- machines in this otter pond creek but it it draws a trust usually gets put in the bucket. And
    pot before you put version Saturn that allows -- usually cut their solder consumption by forty to 50%. So when your business where does that drops down -- to the question actually -- I'll show
    various fumes. There's also added is that you can add to the solder that help -- reclaim the the solder from the -- -- they work. Bomb but it's just it's a consumable that you have to pay for -- -- health
  2. ULVAC cuts gold from package-level solder deposition process with sputtering methods

    Online Articles

    Tue, 13 Mar 2012

    March 13, 2012 -- ULVAC Inc. developed solder deposition processes for silicon device ..... including power devices, that sputters solder to deposit it rather than printing or ..... substrates and provide heat sinks for solder joints. A typical deposition composition

  1. IBM-fine-pitch-substrate-bumping-skips-solder -paste-beyond-C4NP

    Online Articles

    Tue, 23 Nov 2010

    Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate ..... researchers’ work to develop a new pre- solder bumping technology of injection-molded solder (IMS) for fine pitch organic substrates

  2. Osram devises LED solder pad concept for easier second sourcing

    Online Articles

    Thu, 19 Jul 2012

    Semiconductors developed a concept for uniform solder pads based on the Oslon light-emitting ..... differ in the dimensions and shape of their solder pads. For second sourcing, two different ..... the two LED components. The individual solder surfaces are divided into segments, electrically

  3. Cost, production, and logistics implications of C4NP solder bumping

    Magazine Articles

    Mon, 1 Jan 2007

    Process (C4NP), works with lead-free solder alloys. The new process separates the ..... metallization (UBM) deposition from the solder bump deposition, unlike the old process ..... Costs are saved by working with pure solder and relatively simpler capital equipment

  4. A Bumpy Trip for Solder Bumping

    Magazine Articles

    Tue, 1 Nov 2005

    relative market shares of the most common solder bumping methods. The never-ending push towards finer-pitch and lower-cost solder bumping conflicts with the requirement to ..... of today’s contending lead-free solder bumping processes. Pioneered 40 years ago

  5. Lockheed Martin develops new Cu solder

    Online Articles

    Mon, 29 Oct 2012

    new "nanotechnology" copper-based solder that it says will produce joints with up ..... approach was needed to solve the lead-free solder challenge," explains Alfred Zinn , materials ..... in Palo Alto, CA. His invention is a solder paste dubbed "CuantumFuse" that addresses

  6. ASE tests NCKU lower-cost packaging solder as better than SAC

    Online Articles

    Thu, 9 Aug 2012

    silver/aluminum/gallium (SnZnAgAlGa) solder alloy for semiconductor packaging , and ..... commercialization opportunities. The solder offers reliability and cost improvements ..... are looking into turning the alloy into solder balls, so far creating solder balls with

  7. Solder joint failure analysis

    Magazine Articles

    Wed, 1 Jan 2003

    TERRY BURNETTE and THOMAS KOSCHMIEDER Solder joint integrity is of paramount importance ..... circuit board (PCB). Inspection of the solder joints once attached to a PCB can be virtually ..... package destroys all evidence of failed solder joints. Cross-sectioning a BGA that

  8. Solder -free Connectors Using Buckled Pillars

    Magazine Articles

    Thu, 1 Jan 2009

    are put together with screws rather than solder . While still in development stages ..... are put together with screws rather than solder . With appropriate assembly and testing ..... BGA and C4NP is that they both require solder . The solder may be lead-free, but

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