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in manufacturing. It's used for wave solder process. We've machines in this otter ..... version Saturn that allows usually cut their solder consumption by forty to 50%. So when ..... also added is that you can add to the solder that help reclaim the the solder from
March 13, 2012 -- ULVAC Inc. developed solder deposition processes for silicon device ..... including power devices, that sputters solder to deposit it rather than printing or ..... substrates and provide heat sinks for solder joints. A typical deposition composition
Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate ..... researchers’ work to develop a new pre- solder bumping technology of injection-molded solder (IMS) for fine pitch organic substrates
Semiconductors developed a concept for uniform solder pads based on the Oslon light-emitting ..... differ in the dimensions and shape of their solder pads. For second sourcing, two different ..... the two LED components. The individual solder surfaces are divided into segments, electrically
Process (C4NP), works with lead-free solder alloys. The new process separates the ..... metallization (UBM) deposition from the solder bump deposition, unlike the old process ..... Costs are saved by working with pure solder and relatively simpler capital equipment
relative market shares of the most common solder bumping methods. The never-ending push towards finer-pitch and lower-cost solder bumping conflicts with the requirement to ..... of today’s contending lead-free solder bumping processes. Pioneered 40 years ago
new "nanotechnology" copper-based solder that it says will produce joints with up ..... approach was needed to solve the lead-free solder challenge," explains Alfred Zinn , materials ..... in Palo Alto, CA. His invention is a solder paste dubbed "CuantumFuse" that addresses
silver/aluminum/gallium (SnZnAgAlGa) solder alloy for semiconductor packaging , and ..... commercialization opportunities. The solder offers reliability and cost improvements ..... are looking into turning the alloy into solder balls, so far creating solder balls with
TERRY BURNETTE and THOMAS KOSCHMIEDER Solder joint integrity is of paramount importance ..... circuit board (PCB). Inspection of the solder joints once attached to a PCB can be virtually ..... package destroys all evidence of failed solder joints. Cross-sectioning a BGA that
are put together with screws rather than solder . While still in development stages ..... are put together with screws rather than solder . With appropriate assembly and testing ..... BGA and C4NP is that they both require solder . The solder may be lead-free, but