SIP
SIP news and technical articles from Solid State Technology Magazine. Search SIP latest and archived news and articles
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Thermal modeling software aids 3D IC, SoC, SiP designs
… released AceThermalModeler (ATM) for generating compact thermal models of system on chips (SoCs), 3D ICs, systems in package ( SiP ) devices , and complete boards. Compact thermal models enable early system floorplan exploration or partitioning, new system …
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Xilinx, Elpida highlight SEMICON Taiwan's SiP Global Summit
September 19, 2011 - At SEMICON Taiwan 2011, the SiP Global Summit consisted of forums on 3D IC technology, 3D IC test and embedded substrates. In the 3D IC technology forum leaders …
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Non-planar device scaling: SEMATECH talks TSV, SoC, SiP
… significant changes, Jammy predicts. For example, an entire smartphone could be fit onto one SoC. With system in package ( SiP ), additional functionality will be integrated, even MEMS devices. Jammy also reviews SEMATECH's roadmaps for logic and …
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3D progress seen at SiP global summit
The SiP global summit was held during 2011 Semicon Taiwan in Taipei. It consisted of the 3D IC Test Forum "Test Challenges and Solution …
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SEMI convenes system-in-package summit alongside SEMICON Taiwan
… 2011 -- SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located ..... Three forums cover system in package ( SiP ) test, the "3D IC era," and the requirements ..... readers, etc. -- as a major driver for SiP heterogeneous architectures. An ITRI recent …
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MEMS packaging growth, trends, and special requirements
… emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity ..... packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying ..... package co-design & software competencies, SiP module assembly, passive integration and …
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MEMS packaging growth, trends, and special requirements
… emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity ..... packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying ..... package co-design & software competencies, SiP module assembly, passive integration and …
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CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency
… deployable, multi-functioning nanosensors and actuators, integrated system-on-a-chip (SOC) and system-in-a-package ( SIP ) technologies, and protective coatings and materials for the safety and security of military personnel and equipment, among …
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EoPlex builds packaging facility in Malaysia
… semiconductor packages, according to the company. It enables multi-row, complex routed designs and systems-in-package ( SiP ) with reduced capacitive and inductive parasitics. With EoPlex xLC, complete packages can have from 2 to 500+ leads and still …
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Texas Instruments (TI) embedded die package teardown report released
… process. The packaging technology for system-in-packages ( SiP ) embeds the die in a laminate substrate. Most of the packaging ..... discrete and passives, to be mounted on top of the laminate SiP module. The ball pitch is 1.0mm and features 8 pin-count …
