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March 12, 2012 -- ST-Ericsson, wireless semiconductor company, selected planar fully depleted silicon on insulator (FD-SOI) technology from Soitec (Euronext), semiconductor materials maker, for use in future mobile platforms
silicon thickness (via the use of ultra-thin silicon on insulator [SOI] wafers), Leti has demonstrated the ability of fully depleted silicon on insulator (FDSOI) technology to improve CMOS scalability
2011 -- Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon ( Si photonics ), in a video interview
MEMS, nanotechnology and semiconductor manufacturing tool supplier, released a wafer bonding system for 450mm silicon - on - insulator (SOI) wafers: EVG850SOI/450-mm. The automated tool runs at production line speed and comprises a cleaning
Lab. The EVG 301 will remove particles from the surfaces of pre-bonded III-V compound semiconductor and silicon - on - insulator (SOI) wafers as they are fabricated into optical ICs. The EVG301 performs wafer cleaning for various wafer
EVG850 automated production bonding system for silicon - on - insulator (SOI) and direct wafer bonding. Simgui is moving ..... EVG850LT automated production bonding system for silicon - on - insulator (SOI) wafers in its state-of-the-art SOI
expect to see mobile, low-power and system-on-chip (SoC) applications implementing planar fully depleted silicon - on - insulator (FD SOI)-based transistors. For many devices, implementation of the 3D system architecture alone is more
substrate maker Soitec joined SEMATECH's Front End Processes (FEP) and Advanced Metrology Programs, bringing silicon - on - insulator (SOI) wafers and other advanced engineered wafers into the group to work on new processes and technologies
mechanical system (MEMS) components. Multiple optical MEMS (MOEMS) structures can be patterned and etched on silicon on insulator (SOI) wafers using deep reactive ion etching (DRIE) . The structures are then wafer-level packaged and diced
expect to see mobile, low-power and system-on-chip (SoC) applications implementing planar fully depleted silicon - on - insulator (FD SOI)-based transistors. Mask-wafer double simulation: a new requirement Aki Fujimura , CEO, D2S, Inc