Silicon Interposers
Silicon Interposers news and technical articles from Solid State Technology Magazine. Search Silicon Interposers latest and archived news and articles
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Silicon interposers : building blocks for 3D-ICs
… relatively quickly is the use of silicon interposers —a double-sided die with ..... one active die to another. Silicon interposers are being used to stack chips ..... design and production issues, silicon interposers still pose new challenges …
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Interposer consortium ready to expand at Georgia Tech PRC
… and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium ..... They developed glass and silicon interposers with 10x higher I/Os than ..... back end of line (BEOL) silicon interposers . SiGI Phase 1 has demonstrated …
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22nm requires foundry-to-packaging-house cooperation
… Even the package structure may require change. Silicon interposers have already been found to be helpful in handling ..... established, a number of companies may opt for silicon interposers to improve package reliability. Xilinx’s part …
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Silicon interposer partnership sets roadmap
… technology. This includes improving and optimizing silicon interposers and creating standardized process, slows, and ..... Professor Dim-Lee Kwong, executive director of IME. Silicon interposers -- often considered a bridge technology to true …
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Advanced packaging in the new decade
… some foundry players and the IC package contract and assembly test houses on who will do the assembly of die on silicon interposers . The discussion focuses on who will bear responsibility for certifying reliability if the foundry builds the interposer …
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Georgia Tech increases interposer development work
… CTE interposers; Ultra-fine-pitch interconnection, down to 15um pitch; Thermal enhancement of glass and silicon interposers and packages; and Thinfilm Passive planar or IPD integration enhanced by through vias in glass or silicon. The …
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Semiconductor packaging houses gain from more device complexity
… houses like Amkor have invested in 3D packaging technologies, such as through silicon via (TSV) fabrication, silicon interposers , etc. They are also well-positioned for an industry shift occuring from wire bonding to flip chip, which enables …
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Lack of EDA tools, thermal issues impeding 3D packaging technology
… interview at the show. Among the issues Huemoeller sought to emphasize via the 2.5D panel is the importance of silicon interposers , the timeline with respect to their integration, and the assembly and supply constraint challenges. With respect …
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Ushio 200mm litho tool suits 3D packaging steps
… integration (LSI) devices incorporating 3D integration technologies, such as through-silicon vias (TSV) and silicon interposers and bumps. View the system through a panel display at SEMICON Taiwan 2011 , September 7-9 at Taipei World Trade …
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Fab management, packaging, 450mm on our SEMICON Europa agenda
… underfill, HB-LED interconnect), processes ( silicon interposers , flip-chip Cu, ECP) and equipment (organic ..... and Atrenta on 3D system integration, 3D SoC, silicon interposers , and 3D design. -- The 13th European Manufacturing …
