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gasses allow greater materials flexibility. Learn more at http://www.fraunhofer.de/en/ Also read: Deep silicon etching used for key MEMS building blocks by Trikon Technologies Subscribe to our MEMS Direct newsletter
transistor), with 14nm/10nm fabricated prototypes MEMS and NEMS : Scallop-free TSV etching for 3D LSI; deep silicon etching with STiGer process; alternative passivation chemistries for TSVs; wafer-scale hermetic packaging for MEMS; Plasma