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research institute in Grenoble. It addresses the basic technical and economic challenges facing LED lighting by allowing production of LEDs on inexpensive industry-standard 200mm silicon wafers using standard semiconductor processes and tools.
Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in ..... bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.
Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.
the silicon photonics market. “Tezzaron specializes in 3D wafer stacking and TSV processes. We work with dozens of customers ..... government to create advanced 3D-ICs . Their offerings include wafer stacking and die stacking technology with TSVs, Bi-STAR built
uniformly distributed across the wafer . “We suspect that the DSA ..... lithography defects were in the 10K/ wafer range – once in production, defects dropped to under 10K/ wafer . Since this is preliminary ..... about front-end challenges at SEMICON West 2013 and hear from the experts