Semiconductor Process
Semiconductor Process news and technical articles from Solid State Technology Magazine. Search Semiconductor Process latest and archived news and articles
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Semiconductor process technology challenges at 22nm
2012 promises much for the semiconductor industry, and the world. Gartner's Dean Freeman analyzes the roles of semiconductor fab tool makers for 22nm NAND and logic device manufacturing, and the role of chip makers adopting the new node.
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Power management ICs for green energy applications
… the voltage regulator function for the system. The semiconductor process technology required to address these two divergent applications ..... advantages If there is one constant in the world of semiconductor processing , it is that there can never be enough components in …
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poLight taps SVTC for optical MEMS commercialization ramp
… development. Christian Dupont, poLight CEO, noted SVTC's semiconductor processing experience and 8" and 12" wafer capabilities as key ..... development and commercialization services for innovative semiconductor process -based technologies and products, cost effectively …
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Hamilton sensor measures semiconductor process water conductivity without transmitters
Hamilton Company expanded its ARC sensor line with the two-pole Conducell PWSE ARC sensor for process water conductivity measurements. Each sensor uses a built-in microprocessor to communicate with analog or digital modbus interfaces.
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Surrey NanoSystems commercializing advanced packaging innovations with $7M new funding
… the liquid chemicals employed in semiconductor processing - making it a robust and reliable ..... around 700 degrees C - too high for semiconductor processing . In contrast, Surrey NanoSystems ..... applications in areas other than semiconductor processing . The new capital injection coincides …
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The move to 450mm: Europe's perspective
… and second century of semiconductor manufacturing. That question is: Why is a 50%-diameter increase in semiconductor processing platform needed about every decade? As with the previous wafer size transitions, the move to 450mm is largely …
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Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch
… with a total thickness variation of less than 2µm. A TSV contact is buried in the wafer during front-side semiconductor processing . Once the chips are patterned, the wafer is thinned, and an etch step reveals the bottom side of the TSV …
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Evolution or revolution: the path for metrology beyond the 22nm node
… build multiple levels of gates into 3D structures. These vertical architectures lead to new challenges in semiconductor processing technology [7]. As shown in Fig. 2 , the basic building blocks of these features are deep, high aspect …
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Plessey acquires CamGaN for GaN-on-Si LED technology
… can cost 80% more than Si. It reduces scrap rates, minimizes batch time, and enables use of automated semiconductor processing equipment. Also read: GaN-on-Si advances from Translucent and Bridgelux and GaN-on-Si HB-LED demo …
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Semiconductor metrology beyond 22nm: 3D memory metrology
… build multiple levels of gates into 3D structures. These vertical architectures lead to new challenges in semiconductor processing technology [7]. As shown in Figure 2, the basic building blocks of these features are deep, HAR trenches …
