Home>Topics>Semiconductor Packaging
  1. All
  2. Article
  3. Online Articles
  4. Company
  5. Video
  6. Magazine Articles

Semiconductor Packaging

Semiconductor Packaging news and technical articles from Solid State Technology Magazine. Search Semiconductor Packaging latest and archived news and articles

  1. SEMICON West 2012 exhibits preview: Semiconductor packaging products

    Online Articles

    Fri, 22 Jun 2012

    Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer ..... variety of coatings and suspensions used in semiconductor packaging , display manufacturing, fuel cell manufacturing

  2. Ultratech acquires IBM patents for semiconductor packaging processes

    Online Articles

    Fri, 29 Jun 2012

    Nasdaq:UTEK) acquired the rights to a collection of patents from semiconductor leader IBM. Ultratech gained semiconductor packaging technologies including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging

  1. Invensas debuts high-I/O PoP semiconductor packaging design

    Online Articles

    Tue, 22 May 2012

    provider of semiconductor technologies, debuted bond via array (BVA) technology, an ultra-high-I/O semiconductor packaging alternative to wide-I/O through silicon via (TSV) packaging. BVA offers package performance for mobile

  2. Semiconductor packaging substrates future wiring density needs: Join the discussion

    Online Articles

    Thu, 16 Sep 2010

    development, will identify approaches capable of meeting wiring density needs for future generations of organic semiconductor packaging substrates. Meeting these future needs will require radical improvements and innovations in all aspects of organic

  3. Power semiconductor packaging drops wire bonding for sintered foil

    Online Articles

    Wed, 8 Jun 2011

    June 8, 2011 -- Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste

  4. Barry Industries Introduces Semiconductor Packaging Line

    Online Articles

    Tue, 27 May 2008

    (May 26, 2008) Newburyport, MA Barry Industries has introduced a line of semiconductor packaging featuring high temperature cofired ceramic (HTCC) technology for aerospace, RF/microwave, semiconductor, and optoelectronic

  5. Help define semiconductor packaging equipment requirements

    Online Articles

    Fri, 24 Aug 2012

    convergence project on semiconductor packaging equipment requirements ..... input from the industry. Semiconductor packaging , equipment and manufacturing ..... universally understood in the semiconductor packaging industry. It will also

  6. Devan Iyer, director of TI's semiconductor packaging operations, joins The ConFab advisory board

    Online Articles

    Tue, 9 Oct 2012

    Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined ..... semiconductor manufacturing. As Director of TI's worldwide semiconductor packaging operations, Dr. Mahadevan "Devan" Iyer oversees

  7. Amkor (AMKR) names Taiwan leader with semiconductor packaging background

    Online Articles

    Thu, 15 Mar 2012

    record in operations, sales and marketing for semiconductor packaging , wafer processing and testing services ..... National Taiwan University. Amkor provides semiconductor packaging and test services to semiconductor companies

  8. Amkor plans semiconductor packaging and test facility in Korea

    Online Articles

    Sat, 19 May 2012

    development and full scale production of innovative semiconductor packaging and test services for leading semiconductor and ..... noted Joyce. Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS