Semiconductor Packaging
Semiconductor Packaging news and technical articles from Solid State Technology Magazine. Search Semiconductor Packaging latest and archived news and articles
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Invensas debuts high-I/O PoP semiconductor packaging design
… provider of semiconductor technologies, debuted bond via array (BVA) technology, an ultra-high-I/O semiconductor packaging alternative to wide-I/O through silicon via (TSV) packaging. BVA offers package performance for mobile …
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Power semiconductor packaging drops wire bonding for sintered foil
June 8, 2011 -- Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste …
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Amkor plans semiconductor packaging and test facility in Korea
… development and full scale production of innovative semiconductor packaging and test services for leading semiconductor and ..... noted Joyce. Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies …
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One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs
… designed jet cartridge and new software control for semiconductor packaging applications such as flip chip underfill, chip ..... conformal coating, and jetting systems for semiconductor packaging , printed circuit boards, LEDs, flat panel …
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Amkor (AMKR) names Taiwan leader with semiconductor packaging background
… record in operations, sales and marketing for semiconductor packaging , wafer processing and testing services ..... National Taiwan University. Amkor provides semiconductor packaging and test services to semiconductor companies …
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STATS ChipPAC shutters Thailand semiconductor packaging plant after floods
… from strong demand for our services in the communications market," said Koon. STATS ChipPAC Ltd. provides semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications …
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CEA-Leti launches 3D semiconductor packaging platform
… to the initial technical requirements of Leti customers. Figure 1. The Open-3D offer from CEA-Leti. 3D semiconductor packaging can offer performance, form factor, and cost benefits to bio/medical, aeronautics and space, consumer applications …
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Advanced semiconductor packaging start-up Deca could take over SPWR fab
WLCSP start-up Deca Technologies might take over SunPower Corp.'s Fab 1, when the solar photovoltaics supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter.
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AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab
Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore’s Science Park II with its partner in the endeavor, A*STAR.
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TI adds bare die to small-quantity semiconductor packaging options
Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.
