Semicon West news and technical articles from Solid State Technology Magazine. Search Semicon West latest and archived news and articles
This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.
While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new
Just as a boxer avoids a surprise shot to the head or torso by using a “duck and weave” maneuver, so to must front-end technologists confront the challenges associated with extending optical lithography while planning for EUV lithography’s eventual high-productivity solution.
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends ...
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
The flexible and printed electronics community reports encouraging progress in the materials and process ecosystem needed for commercial production — and an increasingly realistic focus on applications that best capitalize on the technology’s strengths. Best near-term prospects now look to be ...
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.
In news from Semicon Japan, a Nikon spokesperson said that the company plans to ship high-volume manufacturing (HVM) lithography tools in 2017, and Intel officially announced a 450mm Japan Metrology Center.