<![CDATA[Multimedia Feed]]><![CDATA[Multimedia Feed]]><![CDATA[Silicon Labs offers bare die from 1 wafer and up]]><![CDATA[Gigaphoton opens Korean subsidiary for DUV, EUV lithography support]]><![CDATA[Microsoft joins Hybrid Memory Cube Consortium]]><![CDATA[Knowles tops 3B MEMS microphones shipped]]><![CDATA[3M dual-brightness enhancement film enables PoE LED-backlit LCD]]><![CDATA[Dow acquires LED phosphor technology IP in Lightscape Materials buy]]><![CDATA[Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology]]><![CDATA[Is the LED boom and bust cycle leveling out?]]><![CDATA[Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing]]><![CDATA[SMIC expands Beijing fab for smaller-node semiconductor manufacturing]]>