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  1. Ferro expands LTCC offering with cost-sensitive materials set

    Article

    Tue, 3 Apr 2012

    Ferro reports, enabling lower-power components. L8 performs well at up to 40GHz (see the figure below). The lead-free, RoHS -compliant glass-ceramic formulation provides high strength and may be used in wire-bond, solderable, brazable, and plateable

  2. Thin-film solar PV suppliers unite under "PVThin" banner

    Article

    Tue, 6 Mar 2012

    PV modules in particular, from the scope of the European Union’s Directive on the Restriction of Hazardous Substances [ RoHS ].) "Because of the small quantities and robustness of the unique semiconductor material used in each solar panel, thin

  1. Copper PV metallization yields 18% solar cell efficiency

    Article

    Mon, 28 Nov 2011

    RENA's InCellPlate technology was used with standard industrial tools for fabrication. The copper-based process meets EU RoHS Directive requirements, avoiding lead and solvents. This same week, Kaneka and imec announced silver-free heterojunction

  2. Kyocera doubles flip-chip assembly with new cleanroom in US

    Article

    Tue, 7 Feb 2012

    Technology Division. "Along with higher volume production, Kyocera now offers lead-free flipchip assembly, ahead of federal RoHS regulations, which take effect in 2014." Kyocera provides assembly services for diverse microelectronics markets, including

  3. 3M debuts high-capacitance ECM for IC packaging, RF, other apps

    Article

    Thu, 2 Feb 2012

    Capacitance Density products offer a 20-40nF/inch 2 capacitance density range. The ECM material is halogen-free and RoHS compliant. Also read: 3M, IBM to make 3D chip adhesives The material matches the needs of increased fidelity and rapid miniaturization

  4. New power MOSFET package from IRF minimizes form factor

    Article

    Mon, 13 Jun 2011

    includes P-Channel devices optimized for use in the high-side of load switches, providing a simpler drive solution. They are RoHS compliant. International Rectifier (NYSE:IRF) provides power management technology via analog and mixed signal ICs, advanced

  5. Henkel power package sintering technology shuns Pb, pressure processing

    Article

    Wed, 13 Jul 2011

    cycles and Henkel’s Ag sintering technology topped 2,000 cycles. Since the sintering process is lead-free, it meets the RoHS requirement for the elimination of lead-based materials from the power device market by 2014. Also read: HB LED packaging

  6. Ferro debuts silver conductor pastes for cost/W savings in solar PV Si module assembly

    Article

    Tue, 12 Jul 2011

    with Ferro’s back surface aluminum pastes and co-fired in a wide processing window. PS 2130 and PS 2131 silver pastes are RoHS - and REACH-compliant, free of lead, cadmium, and phthalates. PS 2130 and PS 2131 are designed for target fired thicknesses

  7. Honeywell doubles semiconductor Cu and Sn production

    Article

    Thu, 15 Sep 2011

    materials. Tin is a lead alternative for chip package soldering, boosted by multiple anti-lead regulations globally, such as EU RoHS . Honeywell is "making supply chain and technology investments" to meet this need, said Mike Norton, product line director

  8. Nanoco-completes-quantum-dot-order

    Article

    Mon, 4 Apr 2011

    including lighting, solar cells, and biological imaging. Nanoco's quantum dots, which are free of heavy metals and comply with RoHS legislation, can be combined into a wide range of materials including liquids, polymers and glass. Nanoco forms strategic

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