Pull Test
Pull Test news and technical articles from Solid State Technology Magazine. Search Pull Test latest and archived news and articles
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Hesse & Knipps heavy wire bonder handles power semis
… apec-conf.org/ ), Booth 914. The BONDJET BJ93x heavy wire bonders feature a heavy wire bond head with integrated pull test and 305 x 410mm table travel for automotive electronics and power semiconductor interconnect requirements. The BONDJET …
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Detecting Brittle Fracture Failures
… fracture failures from both shear and pull test samples showed similarity to those ..... fracture surface after high-speed ball pull test (Sn4.0%/Ag0.5/Cu +OSP ..... corresponds to one solder ball-shear or pull - test speed. These curves can be used …
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Ribbon Wire Bond Testing
… test would better expose poor bonds. Ribbon Pull Test It often makes sense to use a traditional bond pull test . Analogous to the round-wire pull test , this involves inserting a pull hook underneath …
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Wire Bonding Process Control Targeting 100% Yield
… production - including non-destructive pull test and shear test methods, optical ..... A mechanical, non-destructive pull test can be integrated into heavy wire ..... the risk of weakening a bond by the pull test process itself are concerns. Wire …
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Understanding the Complexities of Solder Ball Pull Testing on BGAs
… Figure 1). Figure 1. Cold ball pull test tooling, consisting of two grippers ..... while gripping a sample ball during a pull test is to minimize any structural disturbances ..... in the horizontal plane before the pull test is initiated. Click here to enlarge …
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Cu interconnects with Ru diffusion barriers
… diffraction, stress gauge, tape- pull test , and a four-point electroprobe ..... the points that failed the tape- pull test . Click here to enlarge image Next ..... Ru-SiO 2 interface when a tape- pull test was applied, indicating that the bond strength of …
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Wire Bonding Considerations
… can be evaluated using either a destructive pull test (DPT) or a non-destructive pull test (NDPT). The most commonly accepted standards ..... stability is evaluated by comparing the destructive pull test of the wire bonds after reliability testing …
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A 90nm wafer-level technique for thin-film stress monitoring
… wafers was subjected to a bump- pull test for UBM adhesion evaluation in a ..... and correlated in a separate bump- pull test [3]. Figure 5. Wafer stress maps ..... 1998. J. Li, et al., “Bump Pull Test for Excursion Prevention due to C4 …
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Harman Receives IEEE Award for Wire Bonding Improvements
… version of the nondestructive bond pull test used for MIL-STD-833, and his ..... Basis for the Non-Destructive Bond Pull - Test ," stands alone as the statistical ..... method. The nondestructive bond pull test is currently required for critical …
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Building blocks for wafer-level 3D integration
… conditioning (a); Reliability results for BSI image sensors (b). Also passed: vibration, mechanical shock and pull test (Courtesy of e2v). Unlike adhesive or thermo compressive bonding, the direct low temperature oxide bonding maximizes …
