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  1. New Products

    Article

    Thu, 1 Mar 2012

    manufacturers of power semiconductors and automotive electronics. The bonders feature a heavy wire bond head with integrated pull test and 305 x 410mm table travel for automotive electronics and power semiconductor interconnect requirements. The BONDJET

  2. Hesse & Knipps heavy wire bonder handles power semis

    Article

    Fri, 6 Jan 2012

    apec-conf.org/ ), Booth 914. The BONDJET BJ93x heavy wire bonders feature a heavy wire bond head with integrated pull test and 305 x 410mm table travel for automotive electronics and power semiconductor interconnect requirements. The BONDJET

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