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Pull Test news and technical articles from Solid State Technology Magazine. Search Pull Test latest and archived news and articles

  1. Hesse & Knipps heavy wire bonder handles power semis

    Online Articles

    Fri, 6 Jan 2012

    apec-conf.org/ ), Booth 914. The BONDJET BJ93x heavy wire bonders feature a heavy wire bond head with integrated pull test and 305 x 410mm table travel for automotive electronics and power semiconductor interconnect requirements. The BONDJET

  2. Detecting Brittle Fracture Failures

    Magazine Articles

    Thu, 1 Nov 2007

    fracture failures from both shear and pull test samples showed similarity to those ..... fracture surface after high-speed ball pull test (Sn4.0%/Ag0.5/Cu +OSP ..... corresponds to one solder ball-shear or pull - test speed. These curves can be used

  1. Ribbon Wire Bond Testing

    Magazine Articles

    Wed, 1 Nov 2006

    test would better expose poor bonds. Ribbon Pull Test It often makes sense to use a traditional bond pull test . Analogous to the round-wire pull test , this involves inserting a pull hook underneath

  2. Wire Bonding Process Control Targeting 100% Yield

    Magazine Articles

    Tue, 1 Jan 2008

    production - including non-destructive pull test and shear test methods, optical ..... A mechanical, non-destructive pull test can be integrated into heavy wire ..... the risk of weakening a bond by the pull test process itself are concerns. Wire

  3. Understanding the Complexities of Solder Ball Pull Testing on BGAs

    Magazine Articles

    Tue, 1 Mar 2005

    Figure 1). Figure 1. Cold ball pull test tooling, consisting of two grippers ..... while gripping a sample ball during a pull test is to minimize any structural disturbances ..... in the horizontal plane before the pull test is initiated. Click here to enlarge

  4. Cu interconnects with Ru diffusion barriers

    Magazine Articles

    Sat, 1 Oct 2005

    diffraction, stress gauge, tape- pull test , and a four-point electroprobe ..... the points that failed the tape- pull test . Click here to enlarge image Next ..... Ru-SiO 2 interface when a tape- pull test was applied, indicating that the bond strength of

  5. Wire Bonding Considerations

    Magazine Articles

    Sat, 1 Jul 2006

    can be evaluated using either a destructive pull test (DPT) or a non-destructive pull test (NDPT). The most commonly accepted standards ..... stability is evaluated by comparing the destructive pull test of the wire bonds after reliability testing

  6. A 90nm wafer-level technique for thin-film stress monitoring

    Magazine Articles

    Sat, 1 Oct 2005

    wafers was subjected to a bump- pull test for UBM adhesion evaluation in a ..... and correlated in a separate bump- pull test [3]. Figure 5. Wafer stress maps ..... 1998. J. Li, et al., “Bump Pull Test for Excursion Prevention due to C4

  7. Harman Receives IEEE Award for Wire Bonding Improvements

    Online Articles

    Wed, 13 May 2009

    version of the nondestructive bond pull test used for MIL-STD-833, and his ..... Basis for the Non-Destructive Bond Pull - Test ," stands alone as the statistical ..... method. The nondestructive bond pull test is currently required for critical

  8. Building blocks for wafer-level 3D integration

    Magazine Articles

    Thu, 1 Oct 2009

    conditioning (a); Reliability results for BSI image sensors (b). Also passed: vibration, mechanical shock and pull test (Courtesy of e2v). Unlike adhesive or thermo compressive bonding, the direct low temperature oxide bonding maximizes

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