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2012 promises much for the semiconductor industry, and the world. Gartner's Dean Freeman analyzes the roles of semiconductor fab tool makers for 22nm NAND and logic device manufacturing, and the role of chip makers adopting the new node.
will focus on silicon and non-silicon device and process technology , circuit/device interactions; energy-harvesting ..... Technology Power and Compound Semiconductor Devices Process technology Other topics The submission deadline is June 25
has been released, covering all aspects of PVD process technology , from characterization and preparation of the substrate ..... specifications. It includes the latest developments in PVD process technology . The book covers substrate characterization, adhesion
display maker will use DuPont process technology to make large AMOLED television ..... and the new DuPont's process technology will enable cost-effective ..... animated video on DuPont AMOLED process technology at http://www2.dupont
gone into structured insolvency, failing to find the financing required to expand the facility and upgrade its process technology to produce higher-efficiency solar cells. In 2008, ARISE began increasing photovoltaic (PV) cell production
Marketwire -- Wafer processing equipment maker SPP Process Technology Systems (SPTS) received the investment backing ..... subject to standard competition clearances. SPP Process Technology Systems (SPTS) was established in October 2009
rGaN-HV, optimized for high-voltage power devices in power conversion applications. RFMD states that the GaN process technology reduces system cost and energy consumption in 1-50KW power conversion applications. rGaN-HV delivers device
president, Engineering, Qualcomm, and Andrea Lati, principal analyst, VLSI Research. As advances in materials and process technology continue, the semiconductor manufacturing industry is faced with difficult challenges as it balances costs and
earnings per share of NT$1.29 (US$0.22 per ADR unit) for the first quarter ended March 31, 2012. 28nm process technology accounted for 5% of total wafer revenues, 40nm was 32%, and 65nm was 26%. These advanced technologies accounted
equipments and then scale up to 450mm may be a sometimes preferred route for both OEMs and IDMs, and subsequent process technology development on 300mm wafers, then scale up, a cheaper approach for IDMs to follow. The presence of an appropriate