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Pop news and technical articles from Solid State Technology Magazine. Search Pop latest and archived news and articles
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Invensas debuts high-I/O PoP semiconductor packaging design
… the established package-on-package ( PoP ) architecture with copper wire bonds for stack interconnects. PoP designs package die and stack packages ..... package with TSVs or other technologies. BVA PoP enables reduced pitch and a higher number …
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Henkel underfill boasts high Tg for WLCSP and PoP devices
… level chipscale packages (WLCSP) and package-on-package ( PoP ) devices. LOCTITE UF3810 is formulated to be halogen-free ..... aerospace and automotive sectors for high-reliability CSP and PoP designs. Henkel operates worldwide with brands and technologies …
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Amkor PoP tech surpasses 100M units
… Mold Via (TMV) package-on-package ( PoP ) products. The technology launched about ..... worldwide sales and product management. TMV PoP increases semiconductor integration, miniaturization ..... wirebond and flip chip interconnects. The TMV PoP supports stacked die or passive integration …
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Zymet PoP underfill offers lower viscosity, CTE for finer pitches
… CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package ( PoP ) assemblies. Figure. Void-free underfill of 0.4-mm pitch POP with CN-1736. The underfill boasts low viscosity and a lower CTE than its predecessors …
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Package-on-package (PoP ) track at SMTAI
… Corporation on package-on-package ( PoP ) 3D stacking at SMTA International (SMTAI ..... Technology, will present "Package on Package ( PoP ): Past, Present and Future" during the ..... October 18. Assemblers have integrated PoP surface mount stacking increasingly over …
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Will PoP delay TSV adoption? TechSearch International analyzes the 3D technologies
… May 19, 2011 – Package-on-package ( PoP ) provides a cost/performance solution ..... what in the supply chain , cannot yet meet PoP 's benefits, says TechSearch International ..... be tested separately before assembly with PoP . Standardization of the top memory package …
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STATS ChipPAC brings FOWLP to stacked packages for
… array (eWLB) package-on-package ( PoP ) technology, with a package profile height below 1.0mm. The PoP format aims for higher thermal and electrical ..... packaging (FOWLP) to reduce the bottom PoP package height below 0.5mm. The technology …
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Apple A5X processor teardown: Bigger die, higher heat?
… shares Chipworks. It's also turned off the PoP track. The Apple A4, still a commercially ..... moving from a package-on-package ( PoP ) design with the DRAM to DRAM going on ..... lower power consumption and return to the PoP packaging. Die sizes: Apple A4 Polysilicon …
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Elpida tips 4-layer mobile DRAM package
… package-on-package. The four-layer PoP DRAM combines Elpida's small Mobile RAM ..... rather than the thicker 1.0mm four-layer PoP , so systems that needed 8GB of DRAM needed ..... four-layer 0.8mm size.) Advantages of PoP , particularly for mobile devices: mounting …
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TSV moves to "real engineering," but reliability data needed
… moment. One alternative to TSVs -- package-on-package ( PoP ) -- is going strong. CAGR for PoP is forecasted to be 31% 2009-2015, driven by tablets and smart phones. PoP enables memories from different suppliers to be interchanged on …
