Pop Package
Pop Package news and technical articles from Solid State Technology Magazine. Search Pop Package latest and archived news and articles
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Package-on-Package Trends and Technology
… possible substrates are being used for the bottom and top PoP. Encapsulate molding is a key area that differentiates the PoP package from other stacked-die packages. The bottom PoP requires top center mold gate (TCMG) technology to produce a mold cap …
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Design Considerations for Package on Package Underfill
… creating larger wet-out areas and fillets than seen with similar single level CSP length and width dimensions. Figure 1. PoP Package . Illustration Courtesy of Amkor Technology. Click here to enlarge image In the underfill process, there is a direct correlation …
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2007 Finalist Showcase
… multiple die and larger die sizes in a reduced footprint. Multiple logic, analog, and memory die can be stacked in the bottom PoP package . Smaller, conventional memory packages with center ball grid array (BGA) patterns can be stacked on top, due to an exposed …
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Amkor's Packaging Presentation… diverse technology areas. Over the past ten years so really concentrated. On 3-D. He is the developer I believe that the pop package and one has been really very popular and how popular and in but it's been one of the very first to be in the market. He …
really concentrated. On 3-D. He is the developer I believe that the pop package and -- one has been really very popular and how popular and -- in -- but it's been one of the very -
How 3D is Stacking Up
… bonded stacks. No unusual facilitation or assembly equipment is needed, so the capital investment is small. Next Generation PoP Package -on-package (PoP) interconnects stack packages rather than bare die, allowing an easy mixture of die types and technologies …
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Package-on-Package Space Savings with Flexibility
… been forced to place such devices in individual packages side-by-side on a system board, until now. The advent of the PoP package is providing an attractive solution to those OEMs. PoP is a simple concept - one package is stacked on top of another one …
