Pop Package
Pop Package news and technical articles from Solid State Technology Magazine. Search Pop Package latest and archived news and articles
-
PoP rework: Process control and using the right materials increases yield
… be repaired or upgraded or reworked, PoP packages require a robust, cost-effective ..... article discusses rework solutions. PoP packages present some unique challenges with ..... package-on-package (POP). Warpage POP packages , due to their thin construction, are …
-
Fan-in PoP Allows Flexible Die Parameters
… package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages . The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space …
-
STATS ChipPAC to expand in South Korea
… technology within a single package. In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package ( PoP ), Package -in-Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives …
-
Improving package-on-package reliability: a multi-material approach
… material affords the device support PoP packages – particularly the level two component ..... materials specifically destined for PoP packages . But, as miniaturized devices become ..... reliability of modern, miniaturized PoP packages . Like most things in electronics …
-
Advanced package technologies' growth through 2015
… packages are essentially a vertical multichip package. They come in many forms, including die stacks, package on package ( PoP ), package in package (PiP), TSOP stacks, QFNs, MCMs, and WLPs. Now found in all cell phones, stacked packages are in a high …
-
Elpida tips 4-layer mobile DRAM package
… for mobile devices: mounting space is reduced, individual packages can be tested, there's less wire used (minimizes reflection and noise), and density can be more easily increased. PoP package cross-section. (Source: Elpida)
-
STATS ChipPAC brings FOWLP to stacked packages for
… 30% more than STATS ChipPAC's new 3D eWLB. STATS uses fan-out wafer level packaging (FOWLP) to reduce the bottom PoP package height below 0.5mm. The technology also offers tighter substrate line/space capability. eWLB PoP is available in single …
-
WCSP continues to grow as challenges are met
… possibility, the final package could be a stand-alone TSV-WCSP only, on which components will be stacked later similar to a POP ( package -on-package), or simply embedded inside a substrate or PCB laminate. Among key development areas in a stacked WCSP manufacturing …
-
STATS ChipPAC launches flip chip packaging for advanced silicon nodes
… beyond traditional single-die flip chip packaging into more complex stacked/3D packages including Package-on-Package ( PoP ), Package -in-Package (PiP), flip chip/wire bond hybrid packages and next-generation Through Silicon Via (TSV) configurations …
-
The APAs: Honoring Industry Innovation
… multiple die and larger die sizes in a reduced footprint. Multiple logic, analog, and memory die can be stacked in the bottom PoP package . Smaller, conventional memory packages with center ball grid array (BGA) patterns can be stacked on top, due to an exposed …
