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Pop Package news and technical articles from Solid State Technology Magazine. Search Pop Package latest and archived news and articles

  1. PoP rework: Process control and using the right materials increases yield

    Online Articles

    Mon, 13 Sep 2010

    be repaired or upgraded or reworked, PoP packages require a robust, cost-effective ..... article discusses rework solutions. PoP packages present some unique challenges with ..... package-on-package (POP). Warpage POP packages , due to their thin construction, are

  2. Fan-in PoP Allows Flexible Die Parameters

    Online Articles

    Mon, 26 Mar 2007

    package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages . The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space

  1. STATS ChipPAC to expand in South Korea

    Online Articles

    Mon, 19 Nov 2012

    technology within a single package. In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package ( PoP ), Package -in-Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives

  2. Improving package-on-package reliability: a multi-material approach

    Magazine Articles

    Sat, 1 May 2010

    material affords the device support PoP packages – particularly the level two component ..... materials specifically destined for PoP packages . But, as miniaturized devices become ..... reliability of modern, miniaturized PoP packages . Like most things in electronics

  3. Advanced package technologies' growth through 2015

    Online Articles

    Tue, 27 Dec 2011

    packages are essentially a vertical multichip package. They come in many forms, including die stacks, package on package ( PoP ), package in package (PiP), TSOP stacks, QFNs, MCMs, and WLPs. Now found in all cell phones, stacked packages are in a high

  4. Elpida tips 4-layer mobile DRAM package

    Online Articles

    Fri, 24 Jun 2011

    for mobile devices: mounting space is reduced, individual packages can be tested, there's less wire used (minimizes reflection and noise), and density can be more easily increased. PoP package cross-section. (Source: Elpida)

  5. STATS ChipPAC brings FOWLP to stacked packages for

    Online Articles

    Tue, 6 Mar 2012

    30% more than STATS ChipPAC's new 3D eWLB. STATS uses fan-out wafer level packaging (FOWLP) to reduce the bottom PoP package height below 0.5mm. The technology also offers tighter substrate line/space capability. eWLB PoP is available in single

  6. WCSP continues to grow as challenges are met

    Magazine Articles

    Sun, 1 Nov 2009

    possibility, the final package could be a stand-alone TSV-WCSP only, on which components will be stacked later similar to a POP ( package -on-package), or simply embedded inside a substrate or PCB laminate. Among key development areas in a stacked WCSP manufacturing

  7. STATS ChipPAC launches flip chip packaging for advanced silicon nodes

    Online Articles

    Wed, 16 Feb 2011

    beyond traditional single-die flip chip packaging into more complex stacked/3D packages including Package-on-Package ( PoP ), Package -in-Package (PiP), flip chip/wire bond hybrid packages and next-generation Through Silicon Via (TSV) configurations

  8. The APAs: Honoring Industry Innovation

    Magazine Articles

    Wed, 1 Aug 2007

    multiple die and larger die sizes in a reduced footprint. Multiple logic, analog, and memory die can be stacked in the bottom PoP package . Smaller, conventional memory packages with center ball grid array (BGA) patterns can be stacked on top, due to an exposed

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