Pop Package
Pop Package news and technical articles from Solid State Technology Magazine. Search Pop Package latest and archived news and articles
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STATS ChipPAC brings FOWLP to stacked packages for
… 30% more than STATS ChipPAC's new 3D eWLB. STATS uses fan-out wafer level packaging (FOWLP) to reduce the bottom PoP package height below 0.5mm. The technology also offers tighter substrate line/space capability. eWLB PoP is available in single …
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Advanced package technologies' growth through 2015
… packages are essentially a vertical multichip package. They come in many forms, including die stacks, package on package ( PoP ), package in package (PiP), TSOP stacks, QFNs, MCMs, and WLPs. Now found in all cell phones, stacked packages are in a high …
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Elpida tips 4-layer mobile DRAM package
… for mobile devices: mounting space is reduced, individual packages can be tested, there's less wire used (minimizes reflection and noise), and density can be more easily increased. PoP package cross-section. (Source: Elpida)
