Packaging
Packaging news and technical articles from Solid State Technology Magazine. Search Packaging latest and archived news and articles
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EVG and Dynaloy develop single-wafer cleaning solution
… address thick films and difficult-to-remove material layers for the 3D-ICs /through-silicon vias ( TSVs ), advanced packaging , MEMS and compound semiconductor markets. In its official press release, EVG said CoatsClean provides a complete …
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TSMC keynoter suggests WLSI at IITC
… Fan-out wafer level packages , where individual ..... fan-out wafer level packages with tight ..... fan-out wafer level packages could be ..... possible with wafer level packaging , interposer ..... and using fan - out wafer level packaging or TSV technology …
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Multitest to host annual Open House Week
… applications need to meet dedicated requirements. Semiconductor design and production implement new approaches. Advanced packaging technologies need to be supported by cost-efficient test solutions. Multitest’s handling equipment, contactors …
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Necessary attributes of a MEMS engineer for new product development
In the development of new MEMS products, the team is the most important factor.
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"Generation Mobile": Advanced Packaging Technology at SEMICON West
Advanced packaging technology ..... programs on new packaging technologies and processes ..... IC and wafer - level packaging area alone ..... Enabled by IC Packaging Technologies — Speakers ..... advances in wafer - level packaging , new materials ..... including new System - in - Package (SiP) and Package - on - Package (PoP) methods ..... Thin Chip & Packaging Technologies as Enablers ..... solutions for advanced packaging . Other programs …
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Fab equipment spending: 23% growth for 2014
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
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Bosch reaches 3 billion sensor milestone
Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.
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GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology
… present a number of new challenges to semiconductor manufacturers. GLOBALFOUNDRIES utilizes a "via-middle" approach to TSV integration , inserting the TSVs into the silicon after the wafers have completed the Front End of the Line (FEOL) flow and prior …
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NVIDIA's GPUs; Patent analysis
… with 82 percent of patents filed since 2006," explained Lionel Cadix, technology and market analyst of the Advanced Packaging division at Yole Développement. "Actually about 260 players are involved in 3DIC technology while the top 10 …
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GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.
