Packaging Technologies
Packaging Technologies news and technical articles from Solid State Technology Magazine. Search Packaging Technologies latest and archived news and articles
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RDL: an integral part of today's advanced packaging technologies
… developing many of the newer packaging technologies such as wafer-level packaging ..... a home in other advanced packaging technologies . To incorporate high I ..... 2. Examples of advanced packaging technologies using RDL. In the eWLB …
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RDL: an integral part of today's advanced packaging technologies
… developing many of the newer packaging technologies such as wafer-level packaging ..... a home in other advanced packaging technologies . To incorporate high I ..... 2. Examples of advanced packaging technologies using RDL. In the eWLB …
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Leveraging 3D packaging technologies : Tessera shares its latest work
… packaging and interconnect, speaking with senior technical editor Debra Vogler. The chip industry is using packaging technologies to address miniaturization and density. Materials are posing a challenge. Mitchell sees copper taking a more …
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Advanced packaging technologies : Imbedding components for increased reliability
… the last decade, advanced packaging technologies have shifted to 3D integration ..... direction. Some established packaging technologies integrate bare die of both ..... miniaturization than current packaging technologies , such as SMT , cannot provide …
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3D Packaging Technologies Steal the Show at IMAPS
… primary technology draw at this year's IMAPS International Device Packaging Symposium was anything to do with 3D packaging technologies ; and through silicon via (TSV) processes were clearly stars of the show. Even though the rest of the program …
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ASE, Conexant to exchange advanced packaging technologies
… customers with the latest in state-of-the-art packaging technologies ," says Joe Adam, vice president, packaging ..... ASE's strategy in providing leading-edge packaging technologies to the IC industry," says Dr. Tien Wu, senior …
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3D and 2.5D semiconductor packaging technologies @ The ConFab
As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue “Advanced Packaging and Progress in 3D Integration,” a session focused on the higher I/O density and other performance benefits of ...
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3D Packaging Technologies Expected to Dominate Industry
(April 23, 2008) Palo Alto, CA 3D packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry. Its performance promises to drive efforts across the entire supply chain to successfully deploy it, according to analysis reports from Frost & Sullivan's
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Innovative Advanced Packaging Technologies Enable Leading-edge Wireless Products
By Manish Ranjan, Ultratech Inc. Leading-edge consumer electronic products demand innovative silicon and packaging solutions. While front-end silicon technologies have progressed at a pace defined by Moore's Law, the back-end infrastructure has lagged in similar advancements. This has created an ...
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STATS ChipPAC Builds R&D for Packaging Technologies
(May 16, 2007) SINGAPORE STATS ChipPAC Ltd. will establish a Singapore R&D facility for through-silicon via (TSV), microbumping, die embedding, and advanced substrate technologies to create advanced packages. Core operations will focus on wafer-level processing and advanced wafer integration.
