Packaging Substrate
Packaging Substrate news and technical articles from Solid State Technology Magazine. Search Packaging Substrate latest and archived news and articles
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Nomura divests semiconductor packaging substrate maker shares
… 2011, regarding its share repurchase plan. Established in 1961, Eastern manufactures and sells semiconductor packaging substrates and electronic equipment such as power supply units. With production bases in Japan and China, Eastern had …
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IC packaging substrates heading for $8.67B in 2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operating frequencies improve and integration increases, traditional leadframe packaging is giving way to ...
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Die attach adhesive suits temperature-sensitive electronics
… promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various chip packaging substrates . The DELOMONOPOX adhesive family for die attach adhere to all smart card substrates including silicon, epoxy …
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SEMI convenes system-in-package summit alongside SEMICON Taiwan
… Heterogeneous Integration forum will feature R&D staffers from Nokia, who will discuss the differences between packaging substrates , module substrates and motherboards with an eye on mobile technologies. TechSearch International will also …
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World News
… debris mitigation technology now achieves 93% Sn removal. Nomura has sold all its shares in semiconductor packaging substrate maker Eastern Co. to the firm's parent company. Renesas has divested its audio processing chip business to …
