Packaging Substrate news and technical articles from Solid State Technology Magazine. Search Packaging Substrate latest and archived news and articles
for future generations of organic semiconductor packaging substrates . Meeting these future needs will require radical ..... improvements and innovations in all aspects of organic packaging substrate technology. A piecemeal approach will not be
2011, regarding its share repurchase plan. Established in 1961, Eastern manufactures and sells semiconductor packaging substrates and electronic equipment such as power supply units. With production bases in Japan and China, Eastern had
June 10, 2002 - Taipei, Taiwan - Packaging - substrate maker Phoenix Precision Technology Corp. of Taiwan ..... would meet expected demand for the new-generation packaging substrates from chipset and graphic-chip suppliers in the
Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operating frequencies improve and integration increases, traditional leadframe packaging is giving way to ...
of electronics packaging. “The packaging substrate provides significant potential for ..... Instruments and chair of the iNEMI Packaging Substrates Workshop. “Major innovations are ..... inemi.org/cms/calendar/ Packaging _ Substrates _Nov09.html About iNEMI The International
(November 15, 2010) -- Japan Marketing Survey Co. Ltd. (JMS) published the report "IC Packaging & Substrate Report 2010." It covers production trends of major semiconductor package assemblers and substrate makers and the package market
art IC-substrate manufacturing and meets the technical specifications of major MPU manufacturers. For future packaging substrates , L/S (lines and spaces) become increasingly finer, even below 8/8 µm. This poses a steep challenge for
leaders in the manufacturing of silicon wafers, III-V wafers, advanced chemicals, packaging resins, and packaging substrates . It is estimated that the Japanese material suppliers sales represent about 70% of the global semiconductor
Heterogeneous Integration forum will feature R&D staffers from Nokia, who will discuss the differences between packaging substrates , module substrates and motherboards with an eye on mobile technologies. TechSearch International will also