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project on semiconductor packaging equipment requirements, and is seeking ..... industry. Semiconductor packaging , equipment and manufacturing complexity ..... installation. Semi-custom packaging equipment cannot consistently meet
CALIF. The semiconductor packaging equipment market dropped by 56 percent ..... billion. The list of top 10 packaging equipment suppliers was still topped ..... upcoming demand for advanced packaging equipment such as flip chip bonders
In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.
ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.
April 22, 2002 - Taipei, Taiwan - Chip assembler ChipMos Technologies Ltd. recently acquired the tape carrier packaging (TCP) production lines from Walsin Advanced Electronics Ltd. to boost output capacity to 14 million flat-panel chips/month.
August 23, 2011 -- Assemblon is entering the backend semiconductor packaging equipment market with the A-Series Hybrid, offering parallel placement technology for system-in-package (SiP) assembly, multi chip
February 15, 2012 -- Hesse & Knipps Inc., the Americas subsidiary of backend packaging equipment supplier Hesse & Knipps Semiconductor Equipment GmbH, opened a West Coast Demo and Applications Laboratory at its manufacturer
March 16, 2012 -- Tokyo Electron Limited (TEL) will acquire semiconductor packaging equipment supplier NEXX Systems Inc. NEXX makes advanced deposition equipment, including electrochemical deposition (ECD) and physical
Asia-based ASM Pacific Technology (ASMPT) Group , a supplier of semiconductor assembly, bonding, and packaging equipment , will integrate with the SIPLACE organization in Europe. ASMPT acquired SIPLACE as a business unit under the name
July 8, 2011 -- Canon Inc. made its first foray into the semiconductor back-end packaging equipment market with the new FPA-5510iV for through silicon via (TSV) and bump lithography . The Canon FPA-5510iV semiconductor lithography