Packaging Design
Packaging Design news and technical articles from Solid State Technology Magazine. Search Packaging Design latest and archived news and articles
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Invensas debuts high-I/O PoP semiconductor packaging design
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
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Fairchild Semi opens packaging design center in Korea
Sept. 18, 2002 - South Portland, ME - Fairchild Semiconductor, a global supplier of high performance power products for multiple end markets, has opened a Package and Technology Knowledge Center in Bucheon, South Korea.
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3-D Partitioning of Printed Circuit Design
‘ELEVATED HIGHWAY BYPASS’ PACKAGING DESIGN BY JOSEPH FJELSTAD, GARY YASUMARA ..... Elevated Highway Bypass’ Packaging Design While traditional PCB design ..... Click here to enlarge image This packaging design approach partitions the high …
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Transistor Outline Packages
… second and beyond. The TO PLUS Line reportedly overcomes the normal limitations of a TO by combining glass and packaging design aspects. Up to 6 pins, including higher frequency and DC (electrical) ports, most of the necessary electronics …
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Materials and Methods for IC Package Assemblies
Packaging Design Review BY JOSEPH FJELSTAD he IC is either the pinnacle or the base of electronics hierarchy, and both positions are arguably right …
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IEEE Recognizes Fraunhofer's Reichl
(April 18, 2007) BERLIN The IEEE components, packaging, and manufacturing technology (CPMT) society an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development named professor Herbert Reichl, director of Fraunhofer IZM, recipient of ...
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MEPTEC Announces Keynote for Upcoming Symposium
(July 20, 2005) Mountain View, Calif. — MEPTEC is adding LSI Logic's VP of packaging design and development, Maniam Alagaratnam, as the keynote speaker for its next one-day technical symposium, titled "Semiconductor Packaging Strategies: Improving Costs, Productivity and Total Service to ...
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ASE Standardizes on Ansoft Solution for IC Packaging
(November 5, 2004) Taipei, Taiwan—Advanced Semiconductor Engineering (ASE) announces its commitment to Ansoft's HFSS, Q3D Extractor, and AnsoftLinks simulation products for IC packaging design and model extraction. ASE's standardization on Ansoft extends their existing investment and commitment to ...
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STATS ChipPAC ramps advanced flip chips to HVM, adds TCB processing capability
… as chip-to-substrate or chip-to-chip. STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications. STATS ChipPAC is listed on the …
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STATS ChipPAC rewards top suppliers of 2011
… Wan Choong Hoe, EVP and COO, STATS ChipPAC. STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications including communications, digital …
