Packaging Design
Packaging Design news and technical articles from Solid State Technology Magazine. Search Packaging Design latest and archived news and articles
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Invensas debuts high-I/O PoP semiconductor packaging design
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
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STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board
… board, said Charles Wofford, Chairman of STATS ChipPAC. STATS ChipPAC Ltd. is a service provider of semiconductor packaging design , assembly, test and distribution solutions in communications, digital consumer, computing and other end markets …
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STATS ChipPAC brings FOWLP to stacked packages for
… Conference and Exhibition on Device Packaging this week in Scottsdale, AZ. STATS ChipPAC Ltd. provides semiconductor packaging design , assembly, test and distribution services. STATS ChipPAC is listed on the SGX-ST. Further information is available …
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STATS ChipPAC shutters Thailand semiconductor packaging plant after floods
… strong demand for our services in the communications market," said Koon. STATS ChipPAC Ltd. provides semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications including communications, digital …
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STATS ChipPAC expands WLP capacity with new Singapore facility
… be operational by the fourth quarter of 2012. STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications including communications, digital …
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Cirrus Logic awards STATS ChipPAC for packaging services
… supporting Cirrus Logic. STATS ChipPAC recently named its own top suppliers. STATS ChipPAC Ltd. provides semiconductor packaging design , assembly, test and distribution for communications, digital consumer and computing. STATS ChipPAC is listed …
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STATS ChipPAC expands wafer-level chipscale packaging in Taiwan
… with more than 80 honoured guests and company management participating. STATS ChipPAC Ltd. performs semiconductor packaging design , assembly, test and distribution. STATS ChipPAC is listed on the SGX-ST. Further information is available at …
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STATS ChipPAC names top suppliers of 2010
… enables quality, cost-effective semiconductor packaging and test. STATS ChipPAC Ltd. provides semiconductor packaging design , assembly, test and distribution services. STATS ChipPAC is listed on the SGX-ST. Further information is available …
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STATS ChipPAC adds former STM exec to Board
… the Company's SGX-ST announcement number 00040 dated 1 July 2011. STATS ChipPAC Ltd. provides semiconductor packaging design , assembly, test and distribution services. STATS ChipPAC is listed on the Singapore Exchange Securities Trading …
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STATS ChipPAC expands TSV service with mid-end flow
… low profile solutions for high-performance devices. STATS ChipPAC Ltd. is a service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications including communications, digital …
