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Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
Sept. 18, 2002 - South Portland, ME - Fairchild Semiconductor, a global supplier of high performance power products for multiple end markets, has opened a Package and Technology Knowledge Center in Bucheon, South Korea.
‘ELEVATED HIGHWAY BYPASS’ PACKAGING DESIGN BY JOSEPH FJELSTAD, GARY YASUMARA ..... Elevated Highway Bypass’ Packaging Design While traditional PCB design ..... Click here to enlarge image This packaging design approach partitions the high
second and beyond. The TO PLUS Line reportedly overcomes the normal limitations of a TO by combining glass and packaging design aspects. Up to 6 pins, including higher frequency and DC (electrical) ports, most of the necessary electronics
Packaging Design Review BY JOSEPH FJELSTAD he IC is either the pinnacle or the base of electronics hierarchy, and both positions are arguably right
(April 18, 2007) BERLIN The IEEE components, packaging, and manufacturing technology (CPMT) society an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development named professor Herbert Reichl, director of Fraunhofer IZM, recipient of ...
(July 20, 2005) Mountain View, Calif. — MEPTEC is adding LSI Logic's VP of packaging design and development, Maniam Alagaratnam, as the keynote speaker for its next one-day technical symposium, titled "Semiconductor Packaging Strategies: Improving Costs, Productivity and Total Service to ...
(November 5, 2004) Taipei, Taiwan—Advanced Semiconductor Engineering (ASE) announces its commitment to Ansoft's HFSS, Q3D Extractor, and AnsoftLinks simulation products for IC packaging design and model extraction. ASE's standardization on Ansoft extends their existing investment and commitment to ...
as chip-to-substrate or chip-to-chip. STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications. STATS ChipPAC is listed on the
Wan Choong Hoe, EVP and COO, STATS ChipPAC. STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design , assembly, test and distribution solutions in diverse end market applications including communications, digital