Package Test
Package Test news and technical articles from Solid State Technology Magazine. Search Package Test latest and archived news and articles
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Microsemi taps Amkor for SoC package test
… will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products. Tester platforms at Amkor will be configured to the same set up as Microsemi SoC Products …
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Advantest tackles 3D package test with new product line
Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
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Asia package test house selects Multitest equip for MEMS test
… unloader, InStrip, and InMEMS module for accelerometer MEMS test . The InCarrier won out over standard singulated package test tools and other high-parallel test equipment. Multitest states that InCarrier overcomes strip test constraints with …
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Advanced semiconductor package test emphasized at new BiTS Workshop
The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."
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High-temp area-array package test sockets suit military, geophysical apps
Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200°C.
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Multitest intros 16-site package test handler
Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.
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Multitest wins gravity test handler order for leaded and leadless package test
… against two major competitors. Customer benchmarking included an off-line evaluation phase as well as real production package test . The job includes multi-site test handling of leaded and leadless semiconductor packages. The production facility …
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Keithley semiconductor and package test software update
Keithley Instruments Inc. (NYSE:KEI) updated its ACS Basic Edition Semiconductor Parametric Test Software for semiconductor test and measurement applications. ACS Basic Edition Version 1.2 performs characterization of component or discrete (packaged) semiconductor devices.
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Probe cards for combo wireless package test get boost from Cascade Microtech S-Technology
Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies
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Multitest MT9928 bowl feed module meets small package test handling requirements
The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the ...
