Package Test
Package Test news and technical articles from Solid State Technology Magazine. Search Package Test latest and archived news and articles
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Microsemi taps Amkor for SoC package test
… will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products. Tester platforms at Amkor will be configured to the same set up as Microsemi SoC Products …
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High-temp area-array package test sockets suit military, geophysical apps
Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200°C.
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Asia package test house selects Multitest equip for MEMS test
… unloader, InStrip, and InMEMS module for accelerometer MEMS test . The InCarrier won out over standard singulated package test tools and other high-parallel test equipment. Multitest states that InCarrier overcomes strip test constraints with …
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Advanced semiconductor package test emphasized at new BiTS Workshop
The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."
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Multitest intros 16-site package test handler
Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.
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Multitest wins gravity test handler order for leaded and leadless package test
… against two major competitors. Customer benchmarking included an off-line evaluation phase as well as real production package test . The job includes multi-site test handling of leaded and leadless semiconductor packages. The production facility …
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Multitest delivers MEMS testing for pick-and-place set ups
… test and calibration cart for the MT9510. Multitest MEMS solutions are now available for strip test and singulated package test on Multitest InStrip with optional InCarrier, on gravity test handlers MT93xx and MT9928, or on the MT9510XP tri-temp …
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Multitest test contactor suits large-array, high-pin-count digital chip test
… compliance window to accommodate stack height variations, an optimized force to support large BGAs and LGAs and multisite package test . It uses up to 20GHz differential bandwidth. The Triton was successfully evaluated at high-volume production. Multitest …
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SEMI convenes system-in-package summit alongside SEMICON Taiwan
… technologies. The test section -- 3D-IC Test Forum: Finding Heterogeneous Integration Solutions -- will outline package test challenges that inhibit yields. Executives from ASE, KYEC, and Qualcomm will discuss 3D TSV challenges and cost strategy …
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MIT builds LED underwater
… University (applied physics) about better ways to manufacture electronic circuits than the front-end fab , back-end package , test linear methods in use today. The research was carried out with Media Lab associate professors Edward Boyden and Joseph …
