Package Structure
Package Structure news and technical articles from Solid State Technology Magazine. Search Package Structure latest and archived news and articles
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22nm requires foundry-to-packaging-house cooperation
… to change the assembly process itself. Even the package structure may require change. Silicon interposers have already ..... infrastructure logistics must be worked out. Whatever package structure is adopted, this new era of silicon device technology …
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Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
… Poppas, Mentor Graphics, Nov/Dec 2009 LED Professional Review.) Package characterization measurements reveal package structure 's thermal resistances and thermal capacitances. Simulation software shows specific sections of the design that …
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Invensas demos DFD implementation of its xFD technology
… from a significant reduction in gold and other material usage. Furthermore, the package is manufactured on existing wirebond assembly lines ( Figure 2 ). Figure 2: Dual-die DRAM package structure comparison. (Source: Invensas)
