Package-In-Package
Package-In-Package news and technical articles from Solid State Technology Magazine. Search Package-In-Package latest and archived news and articles
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STATS ChipPAC Ships 25 Millionth Package-in-Package Unit
… Singapore STATS ChipPAC Ltd. has announced it has achieved a milestone of over 25 million units manufactured for its package - in - package (PiP) solutions. PiP is a three dimensional (3D) package technology in which separately assembled and tested …
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STATS ChipPAC to expand in South Korea
… single package. In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package (PoP), Package - in - Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives …
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Advanced package technologies' growth through 2015
… essentially a vertical multichip package. They come in many forms, including die stacks, package on package (PoP), package in package (PiP), TSOP stacks, QFNs, MCMs, and WLPs. Now found in all cell phones, stacked packages are in a high …
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Assembleon intros back-end package assembly robot
… well. A single TPR can assemble all the major package types including naked dies, flip chips, stacked chips , Package - in - Package (PiP) and System in Package (SIP) devices. With the other A-Series robots placing up to 94,000 cph …
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Achieving cost and performance goals using 3D semiconductor packaging
… The primary application is memory for mobile phones. • 3D stacked package-on-package (PoP) and stacked package - in - package (PiP): PoP includes pre-packaged devices that are stacked on top of each other using lead-frame, PCB …
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Achieving cost and performance goals using 3D semiconductor packaging
… The primary application is memory for mobile phones. • 3D stacked package-on-package (PoP) and stacked package - in - package (PiP): PoP includes pre-packaged devices that are stacked on top of each other using lead-frame, PCB …
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STATS ChipPAC launches flip chip packaging for advanced silicon nodes
… single-die flip chip packaging into more complex stacked/3D packages including Package-on-Package (PoP), Package - in - Package (PiP), flip chip/wire bond hybrid packages and next-generation Through Silicon Via (TSV) configurations …
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Rolling Along and Shifting Gears
… opted for newer descriptive terms, such as package-on-package (PoP) for stacked-package solutions, and package - in - package (PiP) for structures where packaged die are repackaged into a super module. Another area that made some significant …
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Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
… stacked-die package system interconnected by multi-level internal wire bonding or wafer bumping. Various package - in - package (PiP) and package-on-package (PoP) architectures are examples of this approach. However, it may be difficult …
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True 3D needs EDA and 300mm
… addition to conventional flip-chip, this year should see the first volume use of package-on-package and package - in - package flip-chip technology. Through-silicon-vias (TSV) certainly result in the smallest packages, the best …
