Package Assembly
Package Assembly news and technical articles from Solid State Technology Magazine. Search Package Assembly latest and archived news and articles
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Cypress Semiconductor transfers back-end packaging lines to China
… Nasdaq:CY ) transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging ..... Cypress' automotive end-customers. The conventional package assembly line transfer was successful from Cypress' standpoint …
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Assembleon launches packaging toolset with low impact force
Assemblon is entering the packaging equipment market with the A-Series Hybrid, offering parallel placement technology for system-in- package assembly , multi chip module manufacturing, and flip chip bonding.
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The Fabless/Foundry Supply Chain
… suppliers must collaborate in chip development. Early engagement, EDA tool flow optimization, turnkey wafer-to- package assembly , and other risk reduction strategies take a design from R&D into high-volume manufacturing. Nick Yu, VP of technology …
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Inari proposes acquisition of Amertron
… electronics manufacturing services, especially in semiconductor packaging, which comprises back-end wafer processing, package assembly and radio-frequency final testing for wireless microwave telecommunications semiconductor products. Learn more …
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ST eliminates wafer probes for on-wafer die test
… Sort (EMWS) was developed from Electrical Wafer Sort (EWS), performed at the end of wafer processing and before package assembly and final test . In EMWS, each die contains a tiny antenna. Automated test equipment (ATE) supplies power and …
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Leading-edge semiconductor materials research at TECHCON 2011
September 16, 2011 -- Whether it's lead-free solder for package assembly or graphene for new transistors, semiconductor materials research was a dominant topic at Semiconductor Research Corporation …
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Package-on-package: thinner, faster, denser
… This density required thinning the FC silicon wafers to 100m and ensuring care in handling the component through package assembly , test and surface mount stacking to avoid die crack and edge chip out defects. Low power DDR speeds up to 167MHz …
