Package Assembly
Package Assembly news and technical articles from Solid State Technology Magazine. Search Package Assembly latest and archived news and articles
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Influence of Design on Package Assembly
… of the supply chain. However, considerations of package assembly and the influence of design decisions on package ..... design features during package design to minimize package assembly defects and maximize assembly yield. DANIEL F …
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Assembleon intros back-end package assembly robot
Assembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment for packaging and IC placement. Plans are in the works for the TPR to do semiconductor manufacturing tasks as
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Flip chip PoP is perfect for mobile, if done right
… implemented with flip chip package assembly , is meeting a lot of the requirements ..... through the lifetime of the package assembly . As the pitch of the flip chip ..... resulting in lower substrate and package assembly yields, reduced manufacturing …
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Cypress Semiconductor transfers back-end packaging lines to China
… Nasdaq:CY ) transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging ..... Cypress' automotive end-customers. The conventional package assembly line transfer was successful from Cypress' standpoint …
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The Great Debate: Copper vs. Gold Ball Bonding
… making gold ball bonding, a mainstay process in package assembly , cost prohibitive. Copper provides a viable alternative ..... process that has a considerable economic effect on package assembly . An alternative wire material to gold is copper …
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Achieving Fine-pitch Ball Placement
… semiconductor packages are placing pressure on IC vendors and packaging specialists to develop faster and more productive package - assembly processes. Ball placement techniques are being fine-tuned to address these issues. Since the wafer-level chip …
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Amkor knocks down back-end operation costs
… Technology, Chandler, AZ, has now fully implemented a high-density semiconductor back-end process that integrates package , assembly , and test. Amkor's newly implemented matrix assembly and test process has moved the "wall" separating conventional …
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Die placement
… product size while producing more functionality, die placement continues to be an important step in the advanced package assembly process. Crucial die placement considerations include the die presentation and metrics, material properties of …
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Palladium-plated packages
… solder; it is more environmentally friendly and the package assembly process with palladium-plated leadframes is more ..... to reduce manufacturing steps and cycle-time in package assembly ; a single plating process can be used to ensure good …
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Assembleon launches packaging toolset with low impact force
Assemblon is entering the packaging equipment market with the A-Series Hybrid, offering parallel placement technology for system-in- package assembly , multi chip module manufacturing, and flip chip bonding.
